Datasheet

L6730 - L6730B Package mechanical data
Doc ID 11938 Rev 3 49/52
11 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Table 14. HTSSOP20 mechanical data
Dim.
mm inch
Min. Typ. Max. Min. Typ. Max.
A 1.200 0.047
A1 0.150 0.006
A2 0.800 1.000 1.050 0.031 0.039 0.041
b 0.190 0.300 0.007 0.012
c 0.090 0.200 0.003 0.008
D
(1)
1. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs
shall not exceed 0.15mm per side.
6.400 6.500 6.600 0.252 0.256 0.260
D1
(3)
2.200 0.087
E 6.200 6.400 6.600 0.244 0.252 0.260
E1
(2)
2. Dimension “E1” does not include interlead flash or protrusions. Intelead flash or protrusions shall not
exceed 0.25mm per side.
4.300 4.400 4.500 0.170 0.173 0.177
E2
(3)
3. The size of exposed pad is variable depending of leadframe design pad size. End user should verify “D1”
and “E2” dimensions for each device application.
1.500 0.059
e 0.650 0.025
L 0.450 0.600 0.750 0.018 0.024 0.030
L1 1.000 0.039
k 0° min., 8° max.
aaa 0.100 0.004