Datasheet
Table Of Contents
- Figure 1. Packages
- Table 1. Order Codes
- 1 Features
- 1.1 APPLICATIONS
- 2 Description
- Figure 2. Block Diagram
- Table 2. Absolute Maximum Ratings
- Figure 3. Pin Connection (Top view)
- Table 3. Thermal Data
- Table 4. Pin Description
- Table 5. Electrical Characteristics (Tj = -25 to 125C, VCC = 12, CO = 1 nF; unless otherwise specified)
- 3 Typical Electrical Characteristics
- Figure 4. Supply current vs. Supply voltage
- Figure 5. Start-up & UVLO vs. Tj
- Figure 6. IC consumption vs. Tj
- Figure 7. Vcc Zener voltage vs. Tj
- Figure 8. Feedback reference vs. Tj
- Figure 9. OVP current vs. Tj
- Figure 10. E/A output clamp levels vs. Tj
- Figure 11. Delay-to-output vs. Tj
- Figure 12. Multiplier characteristic
- Figure 13. Multiplier gain vs. Tj
- Figure 14. Vcs clamp vs. Tj
- Figure 15. Start-up timer vs. Tj
- Figure 16. ZCD clamp levels vs. Tj
- Figure 17. ZCD source capability vs. Tj
- Figure 18. Gate-drive output low saturation
- Figure 19. Gate-drive output high saturation
- Figure 20. Gate-drive clamp vs. Tj
- Figure 21. UVLO saturation vs. Tj
- 4 Application Information
- 4.1 Overvoltage protection
- 4.2 THD optimizer circuit
- Figure 22. THD optimization: standard TM PFC controller (left side) and L6562 (right side)
- Figure 23. Typical application circuit (250W, Wide-range mains)
- Figure 24. Demo board (EVAL6562-80W, Wide-range mains): Electrical schematic
- Figure 25. EVAL6562-80W: PCB and component layout (Top view, real size: 57 x 108 mm)
- Table 6. EVAL6562N: Evaluation results at full load
- Table 7. EVAL6562N: Evaluation results at half load
- Table 8. EVAL6562N: No-load measurements
- Figure 26. Line filter (not tested for EMI compliance) used for EVAL6562N evaluation
- 5 Package Information
- Figure 27. DIP-8 Mechanical Data & Package Dimensions
- Figure 28. SO-8 Mechanical Data & Package Dimensions
- 6 Revision History
- Table 9. Revision History

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L6562
5 Package Information
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These
packages have a Lead-free second level interconnect. The category of second Level Interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 27. DIP-8 Mechanical Data & Package Dimensions
OUTLINE AND
MECHANICAL DATA
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A3.32 0.131
a1 0.51 0.020
B 1.15 1.65 0.045 0.065
b 0.356 0.55 0.014 0.022
b1 0.204 0.304 0.008 0.012
D 10.92 0.430
E 7.95 9.75 0.313 0.384
e2.54 0.100
e3 7.62 0.300
e4 7.62 0.300
F 6.6 0.260
I 5.08 0.200
L 3.18 3.81 0.125 0.150
Z 1.52 0.060
DIP-8