Datasheet

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October 2007 Rev 1 1/16

L6385E

High-voltage high and low side driver

Features

■ High voltage rail up to 600V

■ dV/dt immunity ±50V/nsec in full temperature

range

■ Driver current capability:

– 400mA source,

– 650mA sink

■ Switching times 50/30 nsec rise/fall with 1nF

load

■ CMOS/TTL Schmitt trigger inputs with

hysteresis and pull down

■ Under voltage lock out on lower and upper

driving section

■ Internal bootstrap diode

■ Outputs in phase with inputs

Description

The L6385E is an high-voltage device,

manufactured with the BCD"OFF-LINE"

technology. It has an Half - Bridge Driver structure

that enables to drive independent referenced N

Channel Power MOS or IGBT. The High Side

(Floating) Section is enabled to work with voltage

Rail up to 600V. The Logic Inputs are CMOS/TTL

compatible for ease of interfacing with controlling

devices.

DIP-8 SO-8

www.st.com

Figure 1. Block diagram

LOGIC

DETECTION

LEVEL

SHIFTER

BOOTSTRAP DRIVER

LVG

DRIVER

HIN

LIN

HVG

DRIVER

HVG

H.V.

TO LOAD

OUT

LVG

GND

D97IN514B

Vboot

Cboot

DETECTION

Summary of content (16 pages)

PAGE 1
L6385E High-voltage high and low side driver Features ■ High voltage rail up to 600V ■ dV/dt immunity ±50V/nsec in full temperature range ■ Driver current capability: – 400mA source, – 650mA sink Switching times 50/30 nsec rise/fall with 1nF load ■ CMOS/TTL Schmitt trigger inputs with hysteresis and pull down ■ Under voltage lock out on lower and upper driving section ■ Internal bootstrap diode ■ Outputs in phase with inputs The L6385E is an high-voltage device, manufactured with the BCD"OFF-L
PAGE 2
Contents L6385E Contents 1 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.3 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Pin connection . . . . . . . . . . . . . . . . .
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L6385E Electrical data 1 Electrical data 1.1 Absolute maximum ratings Table 1. Absolute maximum ratings Symbol Parameter Value Unit Vout Output voltage -3 to Vboot -18 V Vcc Supply voltage - 0.3 to +18 V Vboot Floating supply voltage -1 to 618 V Vhvg High sidegate output voltage -1 to Vboot V Vlvg Low side gate output voltage -0.3 to Vcc +0.3 V Logic input voltage -0.3 to Vcc +0.
PAGE 4
Pin connection 2 L6385E Pin connection Figure 2. Pin connection (Top view) LIN 1 8 Vboot HIN 2 7 HVG VCC 3 6 OUT GND 4 5 LVG D97IN517A Table 4. Pin description N° Pin Type Function 1 LIN I Low side driver logic input 2 HIN I High side driver logic input 3 Vcc 4 GND 5 LVG (1) O Low side driver output 6 VOUT O High side driver floating reference 7 HVG (1) O High side driver output 8 Vboot Low voltage power supply Ground Bootstrap supply voltage 1.
PAGE 5
L6385E Electrical characteristics 3 Electrical characteristics 3.1 AC operation Table 5. Symbol 3.2 AC operation electrical characteristcs (VCC = 15V; TJ = 25°C) Pin Parameter Test condition Min Typ Max Unit ton 1 vs 5 High/low side driver turn-on 2 vs 7 propagation delay Vout = 0V 110 ns toff 1 vs 5 High/low side driver turn-off 2 vs 7 propagation delay Vout = 0V 105 ns tr 5, 7 Rise time CL = 1000pF 50 ns tf 5, 7 Fall time CL = 1000pF 30 ns DC operation Table 6.
PAGE 6
Electrical characteristics Table 6. Symbol L6385E DC operation electrical characteristcs (continued)(VCC = 15V; TJ = 25°C) Pin Parameter Test condition Min Typ Max Unit 1.5 V Logic inputs Low level logic threshold voltage Vil 1, 2 High level logic threshold voltage Vih Iih Iil 1, 2 3.6 High level logic input current VIN = 15V Low level logic input current 50 VIN = 0V 1.
PAGE 7
L6385E 4 Bootstrap driver Bootstrap driver A bootstrap circuitry is needed to supply the high voltage section. This function is normally accomplished by a high voltage fast recovery diode (Figure 4 a). In the L6385E a patented integrated structure replaces the external diode. It is realized by a high voltage DMOS, driven synchronously with the low side driver (LVG), with in series a diode, as shown in Figure 4 b. An internal charge pump (Figure 4 b) provides the DMOS driving voltage.
PAGE 8
Bootstrap driver L6385E For example: using a power MOS with a total gate charge of 30nC the drop on the bootstrap DMOS is about 1V, if the Tcharge is 5µs. In fact: 30nC V drop = --------------- ⋅ 125Ω ∼ 0.8V 5µs Vdrop has to be taken into account when the voltage drop on CBOOT is calculated: if this drop is too high, or the circuit topology doesn’t allow a sufficient charging time, an external diode can be used. Figure 4. Bootstrap driver DBOOT VS VBOOT VBOOT VS H.V. HVG H.V.
PAGE 9
L6385E Typical characteristic Figure 5. Typical rise and fall times vs load capacitance time (nsec) D99IN1054 250 Figure 6. Quiescent current vs supply voltage Iq (µA) 104 D99IN1055 200 Tr 103 150 Tf 100 102 50 0 10 0 1 2 3 4 5 C (nF) For both high and low side buffers @25˚C Tamb Figure 7. Turn on time vs temperature 6 8 10 12 14 16 VS(V) Turn Off time vs temperature 250 @ Vcc = 15V @ Vcc = 15V 200 150 150 Toff (ns) Ton (ns) 4 Figure 8. 200 Typ. 100 Typ.
PAGE 10
Typical characteristic L6385E Figure 11. VBOOT UV turn Off threshold vs temperature Figure 12. Output source current vs temperature 1000 14 @ Vcc = 15V @ Vcc = 15V 13 800 current (mA) Vbth2 (V) 12 11 10 9 8 7 600 Typ. 400 200 Typ. 0 6 -45 -25 0 25 50 75 100 -45 125 -25 0 25 50 Tj (°C) 75 100 125 Figure 13. Vcc UV turn On threshold vs Figure 14. Output sink current vs temperature temperature 13 1000 @ Vcc = 15V 800 current (mA) Vccth1(V) 12 11 10 9 Typ. Typ.
PAGE 11
L6385E 6 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark.
PAGE 12
Package mechanical data L6385E Figure 15. DIP-8 mechanical data and package dimensions mm inch DIM. MIN. A TYP. MIN. 3.32 TYP. MAX. 0.51 B 1.15 1.65 0.045 0.065 b 0.356 0.55 0.014 0.022 b1 0.204 0.304 0.008 0.012 E 0.020 10.92 7.95 9.75 0.430 0.313 0.384 e 2.54 0.100 e3 7.62 0.300 e4 7.62 0.300 F 6.6 0.260 I 5.08 0.200 L Z 3.18 OUTLINE AND MECHANICAL DATA 0.131 a1 D 12/16 MAX. 3.81 1.52 0.125 0.150 0.
PAGE 13
L6385E Package mechanical data Figure 16. SO-8 mechanical data and package dimensions mm inch DIM. MIN. TYP. A MAX. MIN. TYP. 1.750 MAX. 0.0689 A1 0.100 0.250 0.0039 A2 1.250 0.0492 b 0.280 0.480 0.0110 0.0189 c 0.170 0.0098 0.230 0.0067 0.0091 4.800 4.900 5.000 0.1890 0.1929 0.1969 E 5.800 6.000 6.200 0.2283 0.2362 0.2441 E1(2) 3.800 3.900 4.000 0.1496 0.1535 0.1575 D (1) e 1.270 0.0500 h 0.250 0.500 0.0098 0.0197 L 0.400 1.270 0.0157 0.0500 L1 k ccc 1.
PAGE 14
Order codes 7 L6385E Order codes Table 7.
PAGE 15
L6385E 8 Revision history Revision history Table 8.
PAGE 16
L6385E Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.