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October 2007 Rev 1 1/17

L6384E

High-voltage half bridge driver

Features

■ High voltage rail up to 600V

■ dV/dt immunity ±50V/nsec in full temperature

range

■ Driver current capability:

– 400mA source,

– 650mA sink

■ Switching times 50/30 nsec rise/fall with 1nF

load

■ CMOS/TTL Schmitt trigger inputs with

hysteresis and pull down

■ Shut down input

■ Dead time setting

■ Under voltage lock out

■ Integrated bootstrap diode

■ Clamping on V

■

SO-8/DIP-8 packages

Description

The L6384E is an high-voltage device,

manufactured with the BCD"OFF-LINE"

technology. It has an Half - Bridge Driver structure

that enables to drive N-channel Power MOS or

IGBT. The High Side (Floating) Section is enabled

to work with voltage Rail up to 600V. The Logic

Inputs are CMOS/TTL compatible for ease of

interfacing with controlling devices. Matched

delays between Low and High Side Section

simplify high frequency operation. Dead time

setting can be readily accomplished by means of

an external resistor.

DIP-8 SO-8

www.st.com

Figure 1. Block diagram

LOGIC

DETECTION

LEVEL

SHIFTER

LVG

DRIVER

DT/SD

BOOT

HVG

DRIVER

HVG

H.V.

LOAD

OUT

LVG

GND

D97IN518A

DEAD

TIME

Idt

Vthi

BOOTSTRAP DRIVER

BOOT

Summary of content (17 pages)

PAGE 1
L6384E High-voltage half bridge driver Features ■ High voltage rail up to 600V ■ dV/dt immunity ±50V/nsec in full temperature range ■ Driver current capability: – 400mA source, – 650mA sink SO-8 Description ■ Switching times 50/30 nsec rise/fall with 1nF load ■ CMOS/TTL Schmitt trigger inputs with hysteresis and pull down ■ Shut down input ■ Dead time setting ■ Under voltage lock out ■ Integrated bootstrap diode ■ Clamping on VCC ■ SO-8/DIP-8 packages Figure 1.
PAGE 2
Contents L6384E Contents 1 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.3 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2 Pin connection . . . . . . . . . . . . . . . . .
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L6384E Electrical data 1 Electrical data 1.1 Absolute maximum ratings Table 1. Absolute maximum ratings Symbol Vout Vcc Is Parameter Output voltage Value Unit -3 to Vboot -18 V Supply voltage (1) - 0.3 to 14.6 V Supply current (1) 25 mA Vboot Floating supply voltage -1 to 618 V Vhvg High side gate output voltage -1 to Vboot V Vlvg Low side gate output voltage -0.3 to Vcc +0.3 V Logic input voltage -0.3 to Vcc +0.3 V Shut down/dead time voltage -0.3 to Vcc +0.
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Electrical data 1.3 L6384E Recommended operating conditions Table 3. Recommended operating conditions Symbol Pin Vout 6 VBS (2) 8 Tj 2 Test condition Min Max Unit (1) 580 V Floating Supply Voltage (1) 17 V 400 kHz Vclamp V 125 °C HVG,LVG load CL = 1nF Supply Voltage Junction Temperature -45 1. If the condition Vboot - Vout < 18V is guaranteed, Vout can range from -3 to 580V. 2.
PAGE 5
L6384E 2 Pin connection Pin connection Figure 2. Pin connection (Top view) IN 1 8 VBOOT VCC 2 7 HVG DT/SD 3 6 VOUT GND 4 5 LVG D97IN519 Table 4. Pin description N° Pin Type Function 1 IN I Logic Input: it is in phase with HVG and in opposition of phase with LVG. It is compatible to VCC voltage. [Vil Max = 1.5V, Vih Min = 3.6V] 2 Vcc Supply input voltage: there is an internal clamp [Typ. 15.
PAGE 6
Electrical characteristics L6384E 3 Electrical characteristics 3.1 AC operation Table 5. Symbol 3.2 AC operation electrical characteristcs (VCC = 14.
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L6384E Electrical characteristics Table 6. Symbol DC operation electrical characteristcs (continued)(VCC = 14.4V; TJ = 25°C) Pin Parameter Test condition Min Typ Max Unit High/Low side driver Iso Source short circuit current VIN = Vih (tp < 10µs) 300 400 mA Sink short circuit current VIN = Vil (tp < 10µs) 500 650 mA 5,7 Isi Logic inputs Low level logic threshold voltage Vil Vih 1,3 1.5 High level logic threshold voltage 3.
PAGE 8
Bootstrap driver 4 L6384E Bootstrap driver A bootstrap circuitry is needed to supply the high voltage section. This function is normally accomplished by a high voltage fast recovery diode (Figure 4 a). In the L6384E a patented integrated structure replaces the external diode. It is realized by a high voltage DMOS, driven synchronously with the low side driver (LVG), with in series a diode, as shown in Figure 4 b. An internal charge pump (Figure 4 b) provides the DMOS driving voltage.
PAGE 9
L6384E Bootstrap driver For example: using a power MOS with a total gate charge of 30nC the drop on the bootstrap DMOS is about 1V, if the Tcharge is 5µs. In fact: 30nC V drop = --------------- ⋅ 125Ω ∼ 0.8V 5µs Vdrop has to be taken into account when the voltage drop on CBOOT is calculated: if this drop is too high, or the circuit topology doesn’t allow a sufficient charging time, an external diode can be used. Figure 4. Bootstrap driver DBOOT VS VBOOT VBOOT VS H.V. H.V.
PAGE 10
Typical characteristic 5 L6384E Typical characteristic Figure 5. Typical rise and fall times vs load capacitance time (nsec) D99IN1015 250 Figure 6. Quiescent current vs supply voltage Iq (µA) 104 D99IN1016 200 Tr 103 150 Tf 100 102 50 0 10 0 1 2 3 4 5 C (nF) For both high and low side buffers @25˚C Tamb Figure 7. Dead time vs resistance 0 2 Figure 8. 4 6 8 10 12 14 VS(V) Driver propagation delay vs temperature 400 3.5 @ Vcc = 14.4V @ Vcc = 14.4V 3.
PAGE 11
L6384E Typical characteristic Figure 11. Vcc UV turn On vs temperature Figure 12. Output source current vs temperature 1000 15 800 Current (mA) Vccth1 (V) 14 13 12 Typ. 11 @ Vcc = 14.4V 600 Typ. 400 200 10 -45 -25 0 25 50 Tj (°C) 75 100 0 -45 125 Figure 13. Vcc UV turn Off vs temperature -25 0 25 50 Tj (°C) 75 100 125 Figure 14. Output sink current vs temperature 13 1000 12 800 Current (mA) Vccth2 (V) @ Vcc = 14.4V 11 10 Typ. 9 Typ.
PAGE 12
Package mechanical data 6 L6384E Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark.
PAGE 13
L6384E Package mechanical data Figure 15. DIP-8 mechanical data and package dimensions mm inch DIM. MIN. A TYP. MAX. MIN. 3.32 TYP. MAX. 0.131 a1 0.51 B 1.15 1.65 0.045 0.065 b 0.356 0.55 0.014 0.022 b1 0.204 0.304 0.008 0.012 0.020 D E 10.92 7.95 9.75 0.430 0.313 0.384 e 2.54 0.100 e3 7.62 0.300 e4 7.62 0.300 F 6.6 0.260 I 5.08 0.200 L Z 3.18 OUTLINE AND MECHANICAL DATA 3.81 1.52 0.125 0.150 DIP-8 0.
PAGE 14
Package mechanical data L6384E Figure 16. SO-8 mechanical data and package dimensions mm inch DIM. MIN. TYP. A MAX. MIN. TYP. 1.750 MAX. 0.0689 A1 0.100 0.250 0.0039 A2 1.250 0.0492 b 0.280 0.480 0.0110 0.0189 c 0.170 0.0098 0.230 0.0067 0.0091 4.800 4.900 5.000 0.1890 0.1929 0.1969 E 5.800 6.000 6.200 0.2283 0.2362 0.2441 E1(2) 3.800 3.900 4.000 0.1496 0.1535 0.1575 D (1) e 1.270 0.0500 h 0.250 0.500 0.0098 0.0197 L 0.400 1.270 0.0157 0.0500 L1 k ccc 1.
PAGE 15
L6384E 7 Order codes Order codes Table 7.
PAGE 16
Revision history 8 L6384E Revision history Table 8.
PAGE 17
L6384E Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.