Datasheet

L6235
20/25
Figure 24. PowerDIP24 Junction-Ambient thermal resistance versus on-board copper area.
Figure 25. SO24 Junction-Ambient thermal resistance versus on-board copper area.
Figure 26. Mounting the PowerSO Package.
39
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48
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1 2 3 4 5 6 7 8 9 101112
Copper Area is on Bottom
Side
Copper Area is on Top Side
sq. cm
ºC / W
On-Board Copper Area
48
50
52
54
56
58
60
62
64
66
68
123456789101112
Copper Area is on Top Side
sq. cm
ºC / W
On-Board Copper Area
Slug soldered
to PCB with
dissipating area
Slug soldered
to PCB with
dissipating area
plus ground layer
Slug soldered to PCB with
dissipating area plus ground layer
contacted through via holes