Datasheet

Application information L6229Q
24/28 Doc ID 15209 Rev 3
6.2 Thermal management
In most applications the power dissipation in the IC is the main factor that sets the maximum
current that can be delivered by the device in a safe operating condition.
Therefore, it has to
be taken into account very carefully. Besides the available space on the PCB, the right
package should be chosen considering the power dissipation. Heat sinking can be achieved
using copper on the PCB with proper area and thickness.
For instance, using a VFQFPN32L 5 x 5 package the typical R
th(JA)
is about 42 °C/W when
mounted on a double-layer FR4 PCB with a dissipating copper area of 0.5 cm
2
on the top
side plus 6 cm
2
ground layer connected through 18 via holes (9 below the IC).