Datasheet

L6229Q Application information
Doc ID 15209 Rev 3 23/28
Figure 23. Typical application
6.1 Output current capability and ic power dissipation
In Figure 24 is shown the approximate relation between the output current and the IC power
dissipation using PWM current control.
For a given output current the power dissipated by the IC can be easily evaluated, in order to
establish which package should be used and how large must be the on-board copper
dissipating area to guarantee a safe operating junction temperature (125 °C maximum).
Figure 24. IC power dissipation versus output power
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
9 10111213141516
32 31 30 29 28 27 26 25
GND
NC
H1 H2 H3
H1 H2H3
NC
NC
NC
NC
NC
NC
BRAKE
FWD/REW
Cp
D1 D2
Vs
8 ÷ 52 VDC
POWER
GROUND
SIGNAL
GROUND
+
_
M
COFF
ROFF
CPUL
RPUL
C3
R4
R2
R3 RDD
RSENSE
ENABLE
CREF1
CREF1
REN
R1
CEN
VREF
Cboot
C1 C2
TACHO NC RCPULSE FW/REW EN VREF
BRAKE
SENSEB
VCP
OUT2
VSA
GND
VSB
OUT3
NC
VBOOT
NC
OUT1
RCOFF
DIAG
H1 H3 H2
SENSEA
to SENSEB
to EN
HALL
SENSOR
THREE-PHASE MOTOR
RH1
RH2
RH3
+5V
+5V
No PWM
f
SW
= 30 kHz (slow decay)
Test Conditions:
Supply Voltage = 24 V
0 0.25 0.5 0.75 1 1.25 1.5
0
2
4
6
8
10
P
I
OUT
[A]
D
[W]
I
OUT
I
1
I
3
I
2
I
OUT
I
OUT