Datasheet

L6229
20/25
Figure 27. PowerDIP24 Junction-Ambient thermal resistance versus on-board copper area.
Figure 28. SO24 Junction-Ambient thermal resistance versus on-board copper area.
Figure 29. Mounting the PowerSO Package.
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1 2 3 4 5 6 7 8 9 101112
Co
pp
er Area is on Bottom
Side
Co
pp
er Area is on To
p
Side
sq. cm
ºC / W
On-Board Copper Area
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60
62
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123456789101112
Copper Area is on Top Side
sq. cm
ºC / W
On-Board Copper Area
Slug soldered
to PCB with
dissipating area
Slug soldered
to PCB with
dissipating area
plus ground layer
Slug soldered to PCB with
dissipating area plus ground layer
contacted through via holes