Datasheet

3/22
L6227
THERMAL DATA
PIN CONNECTIONS (Top View)
(5) The slug is internally connected to pins 1,18,19 and 36 (GND pins).
Symbol Description PowerDIP24 SO24 PowerSO36 Unit
R
th-j-pins
Maximum Thermal Resistance Junction-Pins 19 15 - °C/W
R
th-j-case
Maximum Thermal Resistance Junction-Case - - 2 °C/W
R
th-j-amb1
Maximum Thermal Resistance Junction-Ambient
1
(1) Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the bottom side of 6cm
2
(with a thickness of 35µm).
44 52 - °C/W
R
th-j-amb1
Maximum Thermal Resistance Junction-Ambient
2
(2) Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the top side of 6cm
2
(with a thickness of 35µm).
--36°C/W
R
th-j-amb1
Maximum Thermal Resistance Junction-Ambient
3
(3) Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the top side of 6cm
2
(with a thickness of 35µm), 16 via holes
and a ground layer.
--16°C/W
R
th-j-amb2
Maximum Thermal Resistance Junction-Ambient
4
(4) Mounted on a multi-layer FR4 PCB without any heat sinking surface on the board.
59 78 63 °C/W
PowerDIP24/SO24
PowerSO36
(5)
GND
GND
OUT1
B
RC
B
SENSE
B
IN2
B
IN1
B
1
3
2
4
5
6
7
8
9
VREF
B
VBOOT
EN
B
OUT2
B
VS
B
GND
GND19
18
17
16
15
13
14
D02IN1346
10
11
12
24
23
22
21
20
IN1
A
IN2
A
SENSE
A
RC
A
OUT1
A
VS
A
OUT2
A
VCP
EN
A
VREF
A
GND
N.C.
N.C.
VS
A
RC
A
OUT1
A
N.C.
N.C.
N.C. N.C.
N.C.
OUT1
B
RC
B
N.C.
VS
B
N.C.
N.C.
GND
18
16
17
15
6
5
4
3
2
21
22
31
32
33
35
34
36
20
1
19
GND GND
D02IN1347
IN1
A
SENSE
A
IN2
A
SENSE
B
IN2
B
IN1
B
9
8
7
28
29
30
VREF
A
VREF
B
10 27
OUT2
A
EN
A
VCP
EN
B
OUT2
B
VBOOT
14
12
11
23
25
26
N.C. N.C.
13 24