Datasheet

L6227
18/22
Figure 19. Mounting the PowerSO package.
Figure 20. PowerSO36 Junction-Ambient thermal resistance versus on-board copper area.
Figure 21. PowerDIP24 Junction-Ambient thermal resistance versus on-board copper area.
Figure 22. SO24 Junction-Ambient thermal resistance versus on-board copper area.
Slug soldered
to PCB with
dissipating area
Slug soldered
to PCB with
dissipating area
plus ground layer
Slug soldered to PCB with
dissipating area plus ground layer
contacted through via holes
13
18
23
28
33
38
43
12345678910111213
Without Ground Layer
With Ground Layer
With Ground Layer+16 via
Holes
sq. cm
ºC / W
On-Board Copper Area
39
40
41
42
43
44
45
46
47
48
49
1 2 3 4 5 6 7 8 9 101112
Copper Area is on Bottom
Side
Copper Area is on Top Side
sq. cm
ºC / W
On-Board Copper Area
48
50
52
54
56
58
60
62
64
66
68
123456789101112
Copper Area is on Top Side
sq. cm
ºC / W
On-Board Copper Area