Datasheet

Thermal management L6226Q
24/29 Doc ID 14335 Rev 5
8 Thermal management
In most applications the power dissipation in the IC is the main factor that sets the maximum
current that can be deliver by the device in a safe operating condition. Therefore, it has to be
taken into account very carefully. Besides the available space on the PCB, the right package
should be chosen considering the power dissipation. Heat sinking can be achieved using
copper on the PCB with proper area and thickness. For instance, using a VFQFPN32L 5x5
package the typical R
th(JA)
is about 42 °C/W when mounted on a double-layer FR4 PCB with
a dissipating copper surface of 0.5 cm
2
on the top side plus 6 cm
2
ground layer connected
through 18 via holes (9 below the IC).