L6226 DMOS dual full bridge driver Features ■ Operating supply voltage from 8 to 52 V ■ 2.8 A output peak current (1.4 A DC) ■ RDS(on) 0.73 Ω typ.
Contents L6226 Contents 1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.3 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2 Pin connections . . . . . . . . . . . . . . . . . . .
L6226 Maximum ratings 1 Maximum ratings 1.1 Absolute maximum ratings Table 1. Symbol VS Absolute maximum ratings Parameter Supply voltage Test conditions Value Unit 60 V 60 V -0.3 to +10 V -0.
Maximum ratings 1.3 Thermal data Table 3.
L6226 2 Pin connections Pin connections Figure 2.
Pin connections L6226 Table 4. Pin description (continued) Pin n. SO24/ PowerDIP24 6/31 Name Type Function PowerSO36 Bridge B overcurrent detection and thermal protection pin.An internal open drain Open drain transistor pulls to GND when overcurrent output on bridge B is detected or in case of thermal protection. 9 24 OCDB 10 25 SENSEB 11 26 IN1B Logic input Bridge B input 1 12 27 IN2B Logic input Bridge B input 2 Power supply R pin Bridge B source pin.
L6226 Pin connections Table 4. Pin description (continued) Pin n. Name SO24/ PowerDIP24 PowerSO36 23 8 24 9 ENA PROGCLA Type Function Bridge A enable. LOW logic level switches Logic input OFF all Power MOSFETs of bridge A. If not used, it has to be connected to +5V. R Pin Doc ID 9452 Rev 4 Bridge A overcurrent level programming. A resistor connected between this pin and Ground sets the programmable current limiting value for the bridge A.
Electrical characteristics 3 L6226 Electrical characteristics TA = 25 °C, VS = 48 V, unless otherwise specified Table 5. Electrical characteristics Symbol VSth(ON) Parameter Test conditions Turn-on threshold VSth(OFF) Turn-off threshold IS Tj(OFF) Min Typ Max Unit 5.8 6.3 6.8 V 5 5.
L6226 Table 5. Electrical characteristics Electrical characteristics (continued) Symbol Parameter tdt Dead time protection fCP Charge pump frequency Test conditions Min Typ 0.5 1 Max µs 0.6 -25°C
Electrical characteristics Figure 4.
L6226 Circuit description 4 Circuit description 4.1 Power stages and charge pump The L6226 integrates two independent Power MOS full bridges. Each Power MOS has an RDSon = 0.73 Ω (typical value @ 25 °C), with intrinsic fast freewheeling diode. Cross conduction protection is achieved using a dead time (td = 1μs typical) between the switch off and switch on of two Power MOS in one leg of a bridge.
Circuit description L6226 Figure 6. Logic inputs internal structure 9 (6' 3527(&7,21 ' ,1 Figure 7. ENA and ENB pins open collector driving 2&'$ RU 2&'% 9 9 5(1 23(1 &2//(&725 287387 &(1 (1$ RU (1% ' ,1 Figure 8. ENA and ENB pins push-pull driving 2&'$ RU 2&'% 9 386+ 38// 287387 5(1 (1$ RU (1% &(1 ' ,1 Table 7. Truth table Inputs Outputs EN IN1 IN2 OUT1 OUT2 L X (1) X High Z (2) High Z H L L GND GND H H L Vs GND H L H GND Vs H H H Vs Vs 1.
L6226 4.3 Circuit description Non-dissipative overcurrent detection and protection An overcurrent detection circuit (OCD) is integrated. This circuit can be used to provides protection against a short circuit to ground or between two phases of the bridge as well as a roughly regulation of the load current. With this internal over current detection, the external current sense resistor normally used and its associated power dissipation are eliminated.
Circuit description L6226 Figure 9. Overcurrent protection simplified schematic 287 $ 96$ 287 $ +,*+ 6,'( '026V 2) 7+( %5,'*( $ 32:(5 6(16( FHOO , $ 32:(5 '026 Q FHOOV 72 *$7( /2*,& M& RU /2*,& 9 5(1$ , $ Q , $ Q , $ , $ Q &(1$ ,5() ,17(51$/ 23(1 '5$,1 2&'$ 32:(5 6(16( FHOO 32:(5 '026 Q FHOOV 2&' &203$5$725 (1$ , $ 5'6 21 7 7<3 9 29(5 7(03(5$785( ,5() 352*&/$ ' ,1 5&/$ Figure 10.
L6226 Circuit description Figure 11. Output current protection threshold versus RCL value , 62 9(5 >$ @ N N N N N 5 & / >7 @ N N N Figure 12.
Circuit description L6226 Figure 13. tDELAY versus CEN (VDD = 5 V) WGHOD\ >MV@ 4.4 &HQ >Q)@ Thermal protection In addition to the overcurrent detection, the L6226 integrates a thermal protection for preventing the device destruction in case of junction over temperature. It works sensing the die temperature by means of a sensible element integrated in the die. The device switch-off when the junction temperature reaches 165 °C (typ. value) with 15 °C hysteresis (typ. value).
L6226 5 Application information Application information A typical application using L6226 is shown in Figure 14. Typical component values for the application are shown in Figure 8. A high quality ceramic capacitor in the range of 100 to 200 nF should be placed between the power pins (VSA and VSB) and ground near the L6226 to improve the high frequency filtering on the power supply and reduce high frequency transients generated by the switching.
Paralleled operation 6 L6226 Paralleled operation The outputs of the L6226 can be paralleled to increase the output current capability or reduce the power dissipation in the device at a given current level. It must be noted, however, that the internal wire bond connections from the die to the power or sense pins of the package must carry current in both of the associated half bridges.
L6226 Paralleled operation Figure 15.
Paralleled operation L6226 Figure 16.
L6226 Paralleled operation Figure 17. Paralleling the four half bridges 96 9'& 96$ & 96% & 32:(5 *5281' ' &%227 6,*1$/ *5281' 9&3 ' &3 9%227 6(16($ 6(16(% 287 $ 287 $ /2$' 287 % 287 % *1' *1' *1' *1' 6.
Paralleled operation L6226 Figure 19.
L6226 7 Thermal management Thermal management In most applications the power dissipation in the IC is the main factor that sets the maximum current that can be deliver by the device in a safe operating condition. Therefore, it has to be taken into account very carefully. Besides the available space on the PCB, the right package should be chosen considering the power dissipation. Heat sinking can be achieved using copper on the PCB with proper area and thickness.
Thermal management L6226 Figure 22. PowerDIP24 junction-amb. thermal resistance vs on-board copper area & : 2Q %RDUG &RSSHU $UHD & R S SH U $UH D LV RQ %R WWR P 6 LG H & R S SH U $UH D LV RQ 7R S 6 L GH V T FP Figure 23.
L6226 8 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Table 9. PowerSO36 mechanical data Databook (mm.) Dim. Min Typ. A a1 Max 3.60 0.10 0.30 a2 3.30 a3 0 0.10 b 0.22 0.38 c 0.23 0.32 D (1) 15.80 16.
Package mechanical data L6226 Figure 24.
L6226 Package mechanical data Table 10. Powerdip 24 mechanical data Databook (mm.) Dim. Min Typ. Max A 4.32 A1 0.38 A2 3.3 B 0.41 0.46 0.51 B1 1.4 1.52 1.65 c 0.2 0.25 0.3 D 31.62 31.75 31.88 E 7.62 8.26 e 2.54 E1 6.35 6.6 e1 6.86 7.62 L 3.18 3.43 M 0¢ª min, 15¢ª max. Figure 25.
Package mechanical data L6226 SO-24 MECHANICAL DATA DIM. mm. MIN. TYP inch MAX. MIN. TYP. MAX. A 2.35 2.65 0.093 0.104 A1 0.1 0.30 0.004 0.012 B 0.33 0.51 0.013 0.020 C 0.23 0.32 0.009 0.013 D 15.20 15.60 0.598 0.614 E 7.4 7.6 0.291 0.299 e 1.27 0.050 H 10.00 10.65 0.394 0.419 h 0.25 0.75 0.010 0.030 L 0.4 1.27 0.016 0.050 k 0° 8° 0° 8° ddd 0.100 0.
L6226 9 Ordering codes Ordering codes Table 11.
Revision history 10 L6226 Revision history Table 12.
L6226 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.
