Datasheet

L6208
22/27
Figure 28. PowerSO36 Junction-Ambient Thermal Resistance versus On-Board Copper Area.
Figure 29. PowerDIP24 Junction-Ambient Thermal Resistance versus On-Board Copper Area.
Figure 30. SO24 Junction-Ambient Thermal Resistance versus On-Board Copper Area.
Figure 31. Mounting the PowerSO Package.
13
18
23
28
33
38
43
12345678910111213
Without Ground Layer
With Ground Layer
With Ground Layer+16 via
Holes
sq. cm
ºC / W
On-Board Copper Area
39
40
41
42
43
44
45
46
47
48
49
1 2 3 4 5 6 7 8 9 101112
Copper Area is on Bottom
Side
Copper Area is on Top Side
sq. cm
ºC / W
On-Board Copper Area
48
50
52
54
56
58
60
62
64
66
68
123456789101112
Copper Area is on Top Side
sq. cm
ºC / W
On-Board Copper Area
Slug soldered
to PCB with
dissipating area
Slug soldered
to PCB with
dissipating area
plus ground layer
Slug soldered to PCB with
dissipating area plus ground layer
contacted through via holes