Datasheet
Package and PCB thermal data L5150GJ
20/29 Doc ID 15540 Rev. 12
4 Package and PCB thermal data
4.1 PowerSSO-12 thermal data
Figure 29. PowerSSO-12 PC board
1. Layout condition of R
th
and Z
th
measurements (PCB: double layer, thermal vias,
FR4 area = 77 mm x 86 mm, PCB thickness =1.6 mm, Cu thickness = 70 µm (front and back side) thermal
vias separation 1.2 mm, thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 25 µm,
footprint dimension 4.1 mm x 6.5 mm ).
Figure 30. R
thj-amb
vs PCB copper area in open box free air condition
.
*$3*&)7
57+MBDPE.:
3&%&XKHDWVLQNDUHDFPA
*$3*36