Datasheet

Package and PCB thermal data L5150CJ / L5150CS
22/34 Doc ID 15542 Rev. 15
4.2 SO-8 thermal data
Figure 30. SO-8 PC board
(1)
1. Layout condition of R
th
and Z
th
measurements (PCB: double layer, thermal vias,
FR4 area = 48 mm x 48 mm, PCB thickness = 2 mm, Cu thickness = 35 µm (front and back side),
Cu thickness on vias 25 µm, Footprint dimension 4.1 mm x 6.5 mm ).
Figure 31. R
thj-amb
vs. PCB copper area in open box free air condition
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57+MDPE
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