Datasheet

L5150CJ / L5150CS Package and PCB thermal data
Doc ID 15542 Rev. 15 19/34
4 Package and PCB thermal data
4.1 PowerSSO-12 thermal data
Figure 26. PowerSSO-12 PC board
(1)
1. Layout condition of R
th
and Z
th
measurements (PCB: double layer, thermal vias,
FR4 area = 77 mm x 86 mm, PCB thickness = 1.6 mm, Cu thickness = 70 µm (front and back side),
thermal vias separation 1.2 mm, thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 25 µm,
footprint dimension 4.1 mm x 6.5 mm ).
Figure 27. R
thj-amb
vs PCB copper area in open box free air condition
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57+MDPE
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