Datasheet

Package and PCB thermal data L5150BN
12/20 Doc ID 15541 Rev 9
3 Package and PCB thermal data
3.1 SOT-223 thermal data
Figure 17. SOT-223 PC board
Figure 18. R
thj-amb
vs. PCB copper area in open box free air condition
.
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Note: Layout condition of R
th
and Z
th
measurements (PCB: double layer,
FR4 area= 58 mm x 58 mm, PCB thickness = 2 mm, Cu thickness = 35 µm (front and back side),
footprint dimension 4.1 mm x 6.5 mm ).
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