Datasheet
L4995 Package and PCB thermal data
Doc ID 13103 Rev 14 23/35
4.2 PowerSSO-24 thermal data
Figure 35. PowerSSO-24 PC board
(1)
1. Layout condition of R
th
and Z
th
measurements (PCB: Double layer, Thermal Vias, FR4 area= 77mm x
86mm,PCB thickness=1.6mm, Cu thickness=70μm (front and back side) Thermal vias separation 1.2 mm,
Thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 0.025 mm, Footprint dimension 4.1 mm x
6.5 mm).
Figure 36. R
thj-amb
vs PCB copper area in open box free air condition
GAPGCFT00418
57 +M B D P E & :
'!0'-3
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