Datasheet

Package and PCB thermal data L4995
20/35 Doc ID 13103 Rev 14
4 Package and PCB thermal data
4.1 PowerSSO-12 thermal data
Figure 31. PowerSSO-12 PC board
(1)
1. Layout condition of R
th
and Z
th
measurements (PCB: Double layer, Thermal Vias, FR4 area= 77mm x
86mm,PCB thickness=1.6mm, Cu thickness=70μm (front and back side) Thermal vias separation 1.2 mm,
Thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 0.025 mm, Footprint dimension 4.1 mm x
6.5 mm).
Figure 32. R
thj-amb
vs PCB copper area in open box free air condition
("1($'5
40
45
50
55
60
65
70
0 2 4 6 8 10
RTHj_a_amb(°C/ W)
PCB Cu hea
eatsink areaea ( cm^ 2)
GAPGMS00082