Datasheet

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L293E L293B
MOUNTING INSTRUCTIONS
The R
th j-amb
of the L293B and the L293E can be reduced by soldering the GND pins to a suitable copper
area of the printed circuit board as shown in figure 12 or to an external heatsink (figure 13).
During soldering the pins temperature must not exceed 260°C and the soldering time must not be longer
than 12 seconds.
The external heatsink or printed circuit copper area must be connected to electrical ground.
Figure 12. Example of P.C. Board Copper Area which is Used as Heatsink
Figure 13. External Heatsink Mounting Example (R
th
= 30°C/W)