Datasheet
Table Of Contents
- Figure 1. Functional diagram
- 1 Characteristics
- Table 1. Absolute ratings (Tamb = 25 C)
- Table 2. Electrical characteristics (Tamb = 25 C)
- Figure 2. Pulse waveform
- Figure 3. Typical peak pulse power versus exponential pulse duration
- Figure 4. Clamping voltage versus peak pulse current (exponential waveform 8/20 µs)
- Figure 5. Peak current IDC inducing open circuit of the wire for one input/output versus pulse duration (typical values)
- Figure 6. Junction capacitance versus reverse applied voltage for one input/output (typical values)
- Figure 7. Relative variation of leakage current versus junction temperature
- 2 Application information
- 3 Ordering information scheme
- 4 Package information
- 5 Ordering Information
- 6 Revision history
Package information ITAxxU1
6/8
4 Package information
● Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 11. SO-8 footprint (dimensions in mm)
Table 3. SO-8 dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A1.750.069
A1 0.1 0.25 0.004 0.010
A2 1.25 0.049
b 0.28 0.48 0.011 0.019
C 0.17 0.23 0.007 0.009
D 4.80 4.90 5.00 0.189 0.193 0.197
E 5.80 6.00 6.20 0.228 0.236 0.244
E1 3.80 3.90 4.00 0.150 0.154 0.157
e 1.27 0.050
h 0.25 0.50 0.010 0.020
L 0.40 1.27 0.016 0.050
L1 1.04 0.041
k°0808
ccc 0.10 0.004
E1
D
8
4
1
5
E
e
A
A2
b
A1
ccc C
k
h x 45°
L
L1
C
(Seating
Plane)
0.25mm
(Gage Plane)
C
6.7
4.03
1.27
1.335
0.54