Datasheet

Doc ID 17414 Rev 5 7/9
HSP061-4NY8 Recommendation on PCB assembly
3.3 PCB design
1. To control the solder paste amount, the closed via is recommended instead of open
vias.
2. The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
Figure 13. Printed circuit board layout recommendations
3.4 Reflow profile
Figure 14. ST ECOPACK
®
recommended soldering reflow profile for PCB mounting
Note: Minimize air convection currents in the reflow oven to avoid component movement.
Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020.
400 µm
1
2
4
5
6
8
37
Via to
GND
Via to
GND
Footprint pad PCB tracks
250
0
50
100
150
200
240210180150120906030 300
270
-6°C/s
240-245 °C
2 - 3 °C/s
Temperature (°C)
-2 °C/s
-3 °C/s
Time (s)
0.9 °C/s
60 sec
(90 max)