Datasheet

HSP061-4M10 Recommendation on PCB assembly
Doc ID 023716 Rev 2 9/11
4.4 Reflow profile
Figure 14. ST ECOPACK
®
recommended soldering reflow profile for PCB mounting
Note: Minimize air convection currents in the reflow oven to avoid component movement.
Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020.
250
0
50
100
150
200
240210180150120906030 300
270
-6°C/s
240-245 °C
2 - 3 °C/s
Temperature (°C)
-2 °C/s
-3 °C/s
Time (s)
0.9 °C/s
60 sec
(90 max)