Datasheet

HSP061-4M10 Recommendation on PCB assembly
Doc ID 023716 Rev 2 7/11
4 Recommendation on PCB assembly
Figure 12. Recommended stencil window position
4.1 Solder paste
1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste recommended.
3. Offers a high tack force to resist component displacement during PCB movement.
4. Use solder paste with fine particles: powder particle size 20-45 µm.
Stencil window
Footprint
Copper
Thickness:
100 µm
200 µm
190 µm
15 µm
15 µm
5 µm 5 µm
15 µm
15 µm
400 µm
380 µm
10 µm 10 µm
550 µm
550 µm
580 µm
580 µm