Datasheet

Package information HDMIULC6-4F3
6/9 Doc ID 15511 Rev 3
5 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Figure 11. Package dimensions
400 µm
1600 µm ±40
346 µm
400 µm
200 µm
255 µm
605 µm ±55
1100 µm ± 40
Figure 12. Footprint recommendations Figure 13. Marking
220 µm recommended
220 µm recommended
260 µm maximum
Solder stencil opening:
Copper pad Diameter:
Solder mask opening:
300 µm minimum
x
y
x
w
z
w
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
ECOPACK
®
grade