Datasheet

HDMI05-CL02F3 Package information
Doc ID 15516 Rev 2 7/9
Figure 21. Flip Chip tape and reel specification
Figure 19. Footprint Figure 20. Marking
220 µm recommended
220 µm recommended
260 µm maximum
Solder stencil opening :
Copper pad Diameter:
Solder mask opening:
300 µm minimum
x
y
x
w
z
w
E
Dot, ST logo
xx = marking
yww = datecode
(y = year
ww = week)
z = manufacturing location
User direction of unreeling
All dimensions in mm
4.0 ± 0.1
8.0 ± 0.3
4.0 ± 0.1
1.75 ± 0.1
3.5 ±- 0.1
Ø 1.5 ± 0.1
0.69 ± 0.05
1.24
1.24
ST
E
xxz
yww
ST
E
xxz
yww
ST
E
xxz
yww