Datasheet

AN2994 Thermal measures
Doc ID 15796 Rev 2 29/38
5 Thermal measures
To verify the reliability of the design, a thermal mapping by means of an IR camera has been
done. Figure 38 and Figure 39 show the thermal measurements on the board component
side at nominal input voltages and full load. Pointers (visible on the images) placed across
the key components show the relevant temperature. Table 1 provides the correlation
between the measured points and the components, for both thermal maps. The ambient
temperature during both measurements was 27°C. According to the results obtained, all the
board components are operating within their temperature limits.
Figure 38. Thermal map at 115 Vac, 60 Hz - full load
Figure 39. Thermal map at 230 Vac, 50 Hz - full load
Table 1. Measured temperature at 115 Vac and 230 Vac - full load
Point Component Temperature at 115 Vac Temperature at 230 Vac
A D2 57.3 °C 42.3 °C
B Q2 62.2 °C 48.6 °C
C Q1 62.4 °C 48.3 °C
D D3 60.2 °C 47.8 °C
E C7 38.2 °C 35.4 °C
F L1 53.4 °C 37.2 °C
G L3 55.1 °C 40.1 °C
H L4 – CORE 61.8 °C 49.3 °C
I L4 – WINDING 68.7 °C 52.8 °C