Datasheet
Pin description and connection diagrams HVLED815PF
8/34 DocID023409 Rev 5
2.2 Thermal data
4GND
Ground.
Current return for both the signal part of the IC and the gate drive. All of the ground
connections of the bias components should be tied to a trace going to this pin and kept
separate from any pulsed current return.
5ILED
Constant current (CC) regulation loop reference voltage.
An external capacitor C
LED
is connected between this pin and GND. An internal circuit
develops a voltage on this capacitor that is used as the reference for the MOSFET’s peak drain
current during CC regulation. The voltage is automatically adjusted to keep the average output
current constant.
6DMG
Transformer demagnetization sensing for quasi-resonant operation and output voltage monitor.
A negative-going edge triggers the MOSFET turn-on, to achieve quasi-resonant operation
(zero voltage switching).
The pin voltage is also sampled-and-held right at the end of transformer demagnetization to get
an accurate image of the output voltage to be fed to the inverting input of the internal,
transconductance-type, error amplifier, whose non-inverting input is referenced to 2.5 V. The
maximum I
DMG
sunk/sourced current must not exceed ± 2 mA (AMR) in all the V
IN
range
conditions.
No capacitor is allowed between the pin and the auxiliary transformer.
7COMP
Output of the internal transconductance error amplifier. The compensation network is placed
between this pin and GND to achieve stability and good dynamic performance of the voltage
control loop.
8 N. A. Not available. These pins must be connected to GND.
9 - 11 N. A. Not available. These pins must be left not connected.
12 N. C. Not internally connected. Provision for clearance on the PCB to meet safety requirements.
13 - 16 DRAIN
Drain connection of the internal power section.
The internal high voltage startup generator sinks current from this pin as well. Pins connected
to the internal metal frame to facilitate heat dissipation.
Table 2. Pin description (continued)
No. Name Function
Table 3. Thermal data
Symbol Parameter Max. value Unit
R
thJP
Thermal resistance, junction to pin 10 °C/W
R
thJA
Thermal resistance, junction to ambient 110 °C/W
P
TOT
Maximum power dissipation at T
A
= 50 °C 0.9 W
T
STG
Storage temperature range -55 to 150 °C
T
J
Junction temperature range -40 to 150 °C