Datasheet
L6460 General description
Doc ID 17713 Rev 1 13/139
35 GPIO12 General purpose I/O Analog In/Out - CMOS bi-dir
36 GPIO13 General purpose I/O Analog In/Out - CMOS bi-dir
37 GPIO14 General purpose I/O Analog In/Out - CMOS bi-dir
38 N.C. Not connected
39 DC4_MINUS Bridge 4 phase “minus” output Output
40 DC4_SENSE Bridge 4 sense output
(4)
Output
41 DC3_SENSE Bridge 3 sense output
(4)
Output
42 DC3_MINUS Bridge 3 phase “minus” output Output
43 N.C. Not connected
44 GPIO11 General purpose I/O Analog In/Out - CMOS bi-dir
45 GPIO10 General purpose I/O Analog In/Out - CMOS bi-dir
46 GPIO9 General purpose I/O Analog In/Out - CMOS bi-dir
47 GPIO5 General purpose I/O Analog In/Out - CMOS bi-dir
48 DC3_SENSE Bridge 3 sense output
(4)
Output
49 N.C. Not connected
50 DC3_PLUS Bridge 3 phase “plus” output Output
51 V
Supply
Main voltage supply Power input
52 nRESET Open drain system reset pin CMOS Input/output
53 V
3v3
Internal 3.3 volt regulator Power Input/output
54 V
SupplyInt
Internal voltage supply Power Input
55 GPIO7 General purpose I/O Analog In/Out - CMOS bi-dir
56 V
GPIO_SPI
Low voltage pins power supply Power input
57 GPIO6 General purpose I/O Analog In/Out - CMOS bi-dir
58 V
SWDRV_SW
Switching regulator controller source input Power input
59 V
SWDRV_GATE
Switching driver gate drive pin Analog output
60 V
Pump
Charge pump voltage Power Input/output
61 CPH Charge pump high switch pin Power Input/output
62 CPL Charge pump low switch pin Power Input/output
63 V
Supply
Main voltage supply Power input
64 DC1_plus Bridge 1 phase “plus” output Output
E_Pad GND_PAD
(1)(2)(3)
1. These pins must be connected all together to a unique PCB ground.
2. Bridges1 and 2 have 2 ground pads: one is bonded to the relative ground pin (GND1 or GND2) and the
other is connected to exposed pad (E_Pad) ground ring. This makes the bond wires testing possible by
forcing a current between E-Pad and GND1 or GND2 pins and using the other pin as sense pin to measure
the resistance of E-Pad bonding. (N.B: grounds of two bridges are internally connected together).
3. The analog ground is connected to exposed pad E-Pad.
4. The pin must be tied to ground if bridge is not used as a stepper motor.
Table 2. Pins configuration (continued)
Pin # Pin name Description Type