Datasheet

DocID9453 Rev 2 5/32
L6227 Maximum ratings
32
Table 3. Thermal data
Symbol Description PowerDIP24 SO24 PowerSO36 Unit
R
th-j-pins
Maximum thermal resistance junction pins 19 15 - C/W
R
th-j-case
Maximum thermal resistance junction case - - 2 C/W
R
th-j-amb1
Maximum thermal resistance junction ambient
(1)
44 52 - C/W
R
th-j-amb1
Maximum thermal resistance junction ambient
(2)
--36C/W
R
th-j-amb1
Maximum thermal resistance junction ambient
(3)
--16C/W
R
th-j-amb2
Maximum thermal resistance junction ambient
(4)
59 78 63 C/W
1. Mounted on a multilayer FR4 PCB with a dissipating copper surface on the bottom side of 6 cm
2
(with a thickness
of 35 µm).
2. Mounted on a multilayer FR4 PCB with a dissipating copper surface on the top side of 6 cm
2
(with a thickness
of 35 µm).
3. Mounted on a multilayer FR4 PCB with a dissipating copper surface on the top side of 6 cm
2
(with a thickness
of 35 µm), 16 via holes and a ground layer.
4. Mounted on a multilayer FR4 PCB without any heat sinking surface on the board.