Datasheet

Application information L6227
26/32 DocID9453 Rev 2
Figure 23. PowerDIP24 junction ambient thermal resistance versus on-board copper
area
Figure 24. SO24 junction ambient thermal resistance versus on-board copper area
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LVRQWRSVLGH
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VTFP
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2QERDUGFRSSHUDUHD
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LVRQWRSVLGH