Datasheet

Application information L6227
24/32 DocID9453 Rev 2
8.1 Output current capability and IC power dissipation
In Figure 19 and Figure 20 are shown the approximate relation between the output current
and the IC power dissipation using PWM current control driving two loads, for two different
driving types:
 One full bridge ON at a time (Figure 19) in which only one load at a time is energized.
 Two full bridges ON at the same time (Figure 20) in which two loads at the same time
are energized.
For a given output current and driving type the power dissipated by the IC can be easily
evaluated, in order to establish which package should be used and how large must be the
on-board copper dissipating area to guarantee a safe operating junction temperature
(125 °C maximum).
Figure 19. IC power dissipation versus output current with one full bridge ON
at a time
Figure 20. IC power dissipation versus output current with two full bridges ON at the
same time
1R3:0
I
6:
 N+]VORZGHFD\
7HVWFRQGLWLRQV
6XSSO\YROWDJH 9
,
$
,
%
,
287
,
287
21()8//%5,'*(21$7$7,0(
3
'
>:@
,
287
>$@
      






$0
1R3:0
I
6:
 N+]VORZGHFD\
7HVWFRQGLW LRQV
6XSSO\YROWDJH 9
,
$
,
%
,
287
,
287
3
'
>:@
,
287
>$@
7:2)8//%5,'*(621$77+(6$0(7,0(
      






$0