Datasheet

L6225
16/20
Figure 17. Mounting the PowerSO package.
Figure 18. PowerSO20 Junction-Ambient thermal resistance versus on-board copper area.
Figure 19. PowerDIP20 Junction-Ambient thermal resistance versus on-board copper area.
Figure 20. SO20 Junction-Ambient thermal resistance versus on-board copper area.
Slug soldered
to PCB with
dissipating area
Slug soldered
to PCB with
dissipating area
plus ground layer
Slug soldered to PCB with
dissipating area plus ground layer
contacted through via holes
13
18
23
28
33
38
43
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Without Ground Layer
With Ground Layer
With Ground Layer+16 via
Holes
sq. cm
ºC / W
On-Board Copper Area
sq. cm
ºC / W
On-Board Copper Area
Copper Area is on Bottom Side
Copper Area is on Top Side
33
34
35
36
37
38
39
40
41
42
123456789101112
48
50
52
54
56
58
60
62
64
66
68
123456789101112
Copper Area is on Top Side
sq. cm
ºC / W
On-Board Copper Area