Datasheet

DocID16923 Rev 3 7/11
ESDAXLC6-1MY2 Recommendation on PCB assembly
11
4 Recommendation on PCB assembly
4.1 Stencil opening design
1. General recommendation on stencil opening design
a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 13. Stencil opening dimensions
b) General design rule
Stencil thickness (T) = 75 ~ 125 µm
2. Reference design
a) Stencil opening thickness: 100 µm
b) Stencil opening for central exposed pad: Opening to footprint ratio is 50%.
c) Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 14. Recommended stencil window position
L
T
W
Aspect Ratio
W
T
----- 1 . 5≥=
Aspect Area
LW×
2T L W+()
----------------------------
0.66≥=
Lead footprint on PCB
Stencil window
position
Lead footprint on PCB
Package footprint
0.45 mm
0.39 mm
0.05 mm 0.05 mm
Stencil window
position