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This is information on a product in full production.

March 2014 DocID16923 Rev 3 1/11

ESDAXLC6-1MY2

Extra low capacitance

single line transient voltage surge suppressor (TVS)

Datasheet

production data

Figure 1. Functional diagram

Features

• Extra low capacitance 0.6 pF max on a wide

frequency spectrum (200 MHz - 3000 MHz)

• Unidirectional device

• Low clamping factor V

• Fast response time

• Very thin package: 0.50 mm max

• Low leakage current

• High ESD protection level

• High integration

• Suitable for high density boards

Complies with the following standards

• IEC 61000-4-2 level 4

• MIL STD 883G-Method 3015-7: class 3B

Applications

Where transient over voltage protection and

electrical overstress protection in sensitive

equipment is required, such as:

• Computers

• Printers

• Communication systems

• Cellular phone handsets and accessories

• Video equipment Portable equipment

Description

The ESDAXLC6-1MY2 is a single line Transil™

diode designed specifically for the protection of

integrated circuits in portable equipment and

miniaturized electronics devices subject to ESD

transient over voltages. Packaged in µQFN-2L, it

minimizes PCB consumption.

TM: Transil is a trademark of STMicroelectronics

µQFN-2L

I/01

I/02

GND

www.st.com

Summary of content (11 pages)

PAGE 1
ESDAXLC6-1MY2 Extra low capacitance single line transient voltage surge suppressor (TVS) Datasheet - production data Complies with the following standards • IEC 61000-4-2 level 4 • MIL STD 883G-Method 3015-7: class 3B Applications Where transient over voltage protection and electrical overstress protection in sensitive equipment is required, such as: µQFN-2L • Computers • Printers • Communication systems • Cellular phone handsets and accessories • Video equipment Portable equipment Figure 1.
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Characteristics 1 ESDAXLC6-1MY2 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter VPP Peak pulse voltage: IEC 61000-4-2, level 4: contact discharge PPP Peak pulse power dissipation (8/20 µs) (1) IPP Peak pulse current typical value (8/20 µs) Top Tstg Value Unit kV 8 Tj initial = Tamb 12 W 2.8 A Operating junction temperature range - 40 to + 125 °C Storage temperature range - 55 to +150 °C 1.
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ESDAXLC6-1MY2 Characteristics Figure 3. Junction capacitance versus reverse voltage applied (typical values) 1000 Capacitance (fF) Figure 4. Junction capacitance versus frequency (typical values) 1000 TJ=25-C F=200MHz Vosc=30mVRMS 900 800 800 700 600 600 500 500 400 400 300 300 200 200 100 100 VR(V) 0 1 2 3 4 Frequency (MHz) 0 5 1 Figure 5. S21 (dB) attenuation 0.00 F=1MHz to 3GHz Vosc=30mVRMS Tj=25 °C 900 700 0 C (fF) 10 100 1000 Figure 6.
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Ordering information scheme 2 ESDAXLC6-1MY2 Ordering information scheme Figure 9. Ordering information scheme ESDAX LC ESDA array Low capacitance Breakdown voltage 6 = 6 V minimum Package 1 = 1 line MY = µQFN-2L, max. height: 0.
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ESDAXLC6-1MY2 3 Package information Package information • Epoxy meets UL 94, V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 3. µQFN-2L dimensions Dimensions L1 L2 b1 Ref. Inches Min. Typ. Max. Min. A 0.40 0.47 0.50 0.016 0.
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Package information ESDAXLC6-1MY2 Figure 12. µQFN-2L tape and reel specification 2.0 ± 0.05 Ø 1.50 +0.1/-0.0 4.0 ± 0.1 1.75 ± 0.1 Cathode bar 3.5 ±- 0.05 1.15 ± 0.05 2.0 ± 0.1 User direction of unreeling DocID16923 Rev 3 7 7 7 0.70 ± 0.05 7 6/11 7 All dimensions in mm 7 0.59 ± 0.04 7 8.0 + 0.3 /-0.1 0.20 ± 0.
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ESDAXLC6-1MY2 Recommendation on PCB assembly 4 Recommendation on PCB assembly 4.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 13. Stencil opening dimensions L T b) W General design rule Stencil thickness (T) = 75 ~ 125 µm W Aspect Ratio = ----- ≥ 1.5 T L×W Aspect Area = ---------------------------- ≥ 0.66 2T ( L + W ) 2.
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Recommendation on PCB assembly 4.2 4.3 4.4 8/11 ESDAXLC6-1MY2 Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Solder paste with fine particles: powder particle size is 20-45 µm. Placement 1. Manual positioning is not recommended. 2.
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ESDAXLC6-1MY2 4.5 Recommendation on PCB assembly Reflow profile Figure 15. ST ECOPACK® recommended soldering reflow profile for PCB mounting 240-245 °C Temperature (°C) 250 -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement.
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Ordering information 5 ESDAXLC6-1MY2 Ordering information Table 4. Ordering information 6 Order code Marking Package Weight Base qty Delivery mode ESDAXLC6-1MY2 7 µQFN-2L 0.942 mg 12000 Tape and reel Revision history Table 5. Document revision history 10/11 Date Revision Changes 18-Jan-2010 1 Initial release. 23-Sep-2011 2 Updated package name. 31-Mar-2014 3 Updated operating junction temperature range in Table 2. Updated Figure 3, Figure 4, and Figure 6.
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ESDAXLC6-1MY2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.