Datasheet

Recommendation on PCB assembly ESDAXLC6-1BU2
6/9 DocID023702 Rev 2
3 Recommendation on PCB assembly
3.1 Stencil opening design
Figure 12. Recommended stencil windows position
3.2 Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed
4. Solder paste with fine particles: powder particle size is 20-45 µm.
0.230
(0.0091)
0.183
(0.0072)
0.170
(0.0067)
0.300
(0.0118)
0.285
(0.0112)
0.656
(0.0258)
0.643
(0.0253)
Footprint
Stencil window
0.007
(0.00027)
0.007
(0.00027)
0.008
(0.0003)
0.008
(0.0003)
mm
(inches)
0.243
(0.0096)