Datasheet

Recommendation on PCB assembly ESDAXLC6-1BT2
6/10 DocID023680 Rev 2
3 Recommendation on PCB assembly
3.1 Stencil opening design
1. General recommendation on stencil opening design
a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 12. Stencil opening dimensions
b) General design rule
Stencil thickness (T) = 75 ~ 125 µm
2. Reference design
a) Stencil opening thickness: 100 µm
b) Stencil opening for central exposed pad: Opening to footprint ratio is 50%.
c) Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 13. Recommended stencil window position
L
T
W
Aspect Ratio
W
T
-----
1,5=
Aspect Area
LW
2T L W+
----------------------------
0,66=
Lead footprint on PCB
Stencil window
position
Lead footprint on PCB
Package footprint
0.45 mm
0.39 mm
0.05 mm 0.05 mm
Stencil window
position
0.055 mm