Datasheet

ManualsBrandsSTMICROELECTRONICS ManualsDiodesTVS Diode

This is information on a product in full production.

August 2013 DocID023680 Rev 2 1/10

ESDAXLC6-1BT2

Single-line bidirectional ESD protection for high speed interface

Datasheet - production data

Figure 1. Functional diagram (top view)

Features

 Bidirectional device

 Multiple ESD strike sustainability

 Extra low diode capacitance: 0.4 pF

 Low leakage current

 Thin SOD882 package - 0402 size compatible

 Ultra small: 0.6 mm

 RoHS compliant

Complies with the following standards:

 IEC 61000-4-2 level 4

– 15 kV (air discharge)

– 8 kV (contact discharge)

Applications

Where transient overvoltage protection in ESD

sensitive equipment is required, such as:

 Smartphones, mobile phone and accessories

 Tablets, netbooks and notebooks

 Portable multimedia players and accessories

 Digital cameras and camcorders

 Communication systems

Description

The ESDAXLC6-1BT2 is a bidirectional single line

TVS diode designed to protect the data lines or

other I/O ports against ESD transients.

The device is ideal for applications where both

reduced line capacitance and board space saving

are required.

SOD882T

ESDAXLC6-1BT2

Pin1

www.st.com

Summary of content (10 pages)

PAGE 1
ESDAXLC6-1BT2 Single-line bidirectional ESD protection for high speed interface Datasheet - production data Features  Bidirectional device  Multiple ESD strike sustainability  Extra low diode capacitance: 0.4 pF  Low leakage current  Thin SOD882 package - 0402 size compatible  Ultra small: 0.6 mm2  RoHS compliant SOD882T ESDAXLC6-1BT2 Complies with the following standards: Figure 1.
PAGE 2
Characteristics 1 ESDAXLC6-1BT2 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Note: Parameter Value Unit ± 16 ± 25 kV VPP Peak pulse voltage: IEC 61000-4-2 contact discharge IEC 61000-4-2 air discharge PPP Peak pulse power (8/20 µs) 40 W IPP Peak pulse current (8/20 µs) 1.
PAGE 3
ESDAXLC6-1BT2 Characteristics Figure 3. Leakage current versus junction temperature (typical values) Figure 4. Junction capacitance versus applied voltage (typical values) C (pF) IR(nA) 0.8 10 0.7 0.6 1 0.5 0.4 0.3 0.1 0.2 0.1 Tj(°C) 0.01 25 50 75 100 125 150 Figure 5. ESD response to IEC 61000-4-2 (+8 kV contact discharge) VR (V) 0 0 1 2 4 5 Figure 6.
PAGE 4
Package information 2 ESDAXLC6-1BT2 Package information  Epoxy meets UL94, V0  Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 8. SOD882 thin dimension definitions L1 L2 b1 b2 PIN # 1 ID e A1 A E D Table 3.
PAGE 5
ESDAXLC6-1BT2 Package information Figure 9. Footprint dimension in mm (inches) 0.55 (0.022) 0.55 (0.022) 0.50 0.020 0.40 (0.016) Figure 10. Marking Pin 1 Product marking may be rotated by multiples of 180° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Bar indicates Pin1 Ø 1.50 ± 0.1 4.0 ± 0.1 2.0 ± 0.05 3.5 ± 0.05 1.15 ± 0.5 0.20 ± 0.2 1.75 ± 0.1 Figure 11.
PAGE 6
Recommendation on PCB assembly ESDAXLC6-1BT2 3 Recommendation on PCB assembly 3.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 12. Stencil opening dimensions L T b) W General design rule Stencil thickness (T) = 75 ~ 125 µm W Aspect Ratio = -----  1,5 T LW Aspect Area = ----------------------------  0,66 2T  L + W  2.
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ESDAXLC6-1BT2 3.2 3.3 3.4 Recommendation on PCB assembly Solder paste 1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste recommended. 3. Offers a high tack force to resist component displacement during PCB movement. 4. Use solder paste with fine particles: powder particle size 20-45 µm. Placement 1. Manual positioning is not recommended. 2.
PAGE 8
Recommendation on PCB assembly 3.5 ESDAXLC6-1BT2 Reflow profile Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting 240-245 °C Temperature (°C) 250 -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020.
PAGE 9
ESDAXLC6-1BT2 4 Ordering information Ordering information Figure 15. Ordering information scheme ESDA XLC 6 - 1B T2 ESDA array Extra low capacitance Breakdown voltage 6 = 6 V min Direction B = Bidirectional Package T2 = Thin SOD882 (SOD882T) Table 4. Ordering information Order code Marking Package Weight Base qty Delivery mode ESDAXLC6-1BT2 T(1) SOD882T 0.8 mg 12000 Tape and reel 1.
PAGE 10
ESDAXLC6-1BT2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.