Datasheet

Recommendation on PCB assembly ESDAVLC8-1BU2
8/11 Doc ID 16546 Rev 2
4 Recommendation on PCB assembly
4.1 Stencil opening design
Figure 15. Recommended stencil windows position
4.2 Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed
4. Solder paste with fine particles: powder particle size is 20-45 µm.
0.425
0.20
0.038
0.065
Footprint
Stencil window
0.040
0.038
0.30
0.320
0.425
1.05
0.225