Datasheet

Recommendation on PCB assembly ESDAVLC8-1BM2, ESDAVLC8-1BT2
12/14 Doc ID 16937 Rev 2
4.5 Reflow profile
Figure 26. ST ECOPACK
®
recommended soldering reflow profile for PCB mounting
Note: Minimize air convection currents in the reflow oven to avoid component movement.
60 sec
(90 max)
250
0
50
100
150
200
240210180150120906030 300
270
-2 °C/s to
-3 °C/s
-6 °C/s max
240-245 °C
2 - 3 °C/s
0.9 °C/s
Temperature (°C)
Time (s)