Datasheet

ManualsBrandsSTMICROELECTRONICS ManualsDiodesTVS Diode

This is information on a product in full production.

June 2012 Doc ID 16937 Rev 2 1/14

ESDAVLC8-1BM2, ESDAVLC8-1BT2

Single-line low capacitance Transil™,

transient surge voltage suppressor (TVS) for ESD protection

Datasheet − production data

Features

■ Single-line bidirectional protection

■ Breakdown voltage = 8.5 V min.

■ Very low capacitance = 4.5 pF @ 0 V

■ Lead-free packages

■ ECOPACK

2 compliant packages

Benefits

■ Very low capacitance for optimized data

integrity

■ Very low reverse current < 50 nA

■ Low PCB space consumption: 0.6 mm

max

■ High reliability offered by monolithic integration

Complies with the following standards:

■ IEC 61000-4-2 level 4

– 15 kV (air discharge)

– 8 kV (contact discharge)

■ MIL STD 883G - Method 3015-7: class 3

– HBM (human body model)

Applications

Where transient overvoltage protection in ESD

sensitive equipment is required, such as:

■ Computers

■ Printers

■ Communication systems

■ Cellular phone handsets and accessories

■ Video equipment

Figure 1. Functional diagram

Description

The ESDAVLC8-1BM2 and ESDAVLC8-1BT2 are

bidirectional single-line TVS diodes designed to

protect data lines or other I/O ports against ESD

transients.

The devices are ideal for applications where both

printed circuit board space and power absorption

capability are required.

TM: Transil is a trademark of STMicroelectronics

SOD882

ESDAVLC8-1BM2

SOD882T

ESDAVLC8-1BT2

I/O1

I/O2

www.st.com

Summary of content (14 pages)

PAGE 1
ESDAVLC8-1BM2, ESDAVLC8-1BT2 Single-line low capacitance Transil™, transient surge voltage suppressor (TVS) for ESD protection Datasheet − production data Features ■ Single-line bidirectional protection ■ Breakdown voltage = 8.5 V min. ■ Very low capacitance = 4.5 pF @ 0 V ■ Lead-free packages ■ ECOPACK®2 compliant packages Benefits ■ Very low capacitance for optimized data integrity ■ Very low reverse current < 50 nA ■ Low PCB space consumption: 0.
PAGE 2
Characteristics 1 ESDAVLC8-1BM2, ESDAVLC8-1BT2 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter IEC 61000-4-2 contact discharge IEC 61000-4-2 air discharge MIL STD 883G - Method 3015-7: class 3 VPP(1) Peak pulse voltage PPP(1) Peak pulse power dissipation (8/20 µs) Tj initial = Tamb Value Unit 17 17 25 kV 30 W 1.
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ESDAVLC8-1BM2, ESDAVLC8-1BT2 Figure 3. Characteristics Relative variation of peak pulse power versus initial junction temperature Figure 4. PPP[Tjinitial] /PPP[Tjinitial = 25 °C] 1.1 Junction capacitance versus reverse voltage applied (typical values, direct and reverse) C(pF) 5 F = 1 MHz VOSC= 30 mVRMS Tj = 25 °C 1.0 0.9 4 0.8 0.7 3 0.6 0.5 2 0.4 0.3 1 0.2 0.1 0.0 Tj (°C) 0 25 Figure 5. 10000 50 75 100 125 150 0 VLINE (V) 0 1 Peak pulse power versus Figure 6.
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Characteristics Figure 9. 1000 ESDAVLC8-1BM2, ESDAVLC8-1BT2 Relative variation of leakage current versus junction temperature (direct) Figure 10. Relative variation of leakage current versus junction temperature (reverse) IR [Tj] /IR [Tj = 25°C] 1000 IR [Tj] /IR [Tj = 25°C] (typical values – reverse) (typical values – direct) 100 100 10 10 Tj (°C) 1 25 50 75 100 125 150 Figure 11. ESD response to IEC 61000-4-2 (+15kV air discharge) Tj (°C) 1 25 50 75 100 125 Figure 12.
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ESDAVLC8-1BM2, ESDAVLC8-1BT2 2 Ordering information scheme Ordering information scheme Figure 15. Ordering information scheme ESDA VLC 8 - 1 B x2 ESD array Very low capacitance Breakdown voltage 8 = 8.
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Package information 3 ESDAVLC8-1BM2, ESDAVLC8-1BT2 Package information ● Epoxy meets UL94, V0 ● Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 16. SOD882 dimension definitions L1 L2 b1 b2 PIN # 1 ID e A A1 E D Table 3.
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ESDAVLC8-1BM2, ESDAVLC8-1BT2 Package information Figure 17. SOD882 footprint in mm (inches) 0.55 0.022 0.020 0.55 0.022 Figure 18. SOD882 marking 0.50 I Pin1 Pin 2 0.40 0.016 Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Figure 19. SOD882 tape and reel specifications 2.0 ± 0.05 Ø 1.50 ± 0.10 4.0 ± 0.1 1.
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Package information ESDAVLC8-1BM2, ESDAVLC8-1BT2 Figure 20. SOD882T dimension definitions L1 L2 b1 b2 PIN # 1 ID e A1 A E D Table 4. SOD882T dimension values Dimensions Ref. Millimeters Min. Inches Typ. Max. Min. Typ. Max. A 0.30 0.40 0.012 0.016 A1 0.00 0.05 0.000 0.002 b1 0.45 0.50 0.55 0.018 0.020 0.022 b2 0.45 0.50 0.55 0.018 0.020 0.022 D 0.55 0.60 0.65 0.022 0.024 0.026 E 0.95 1.00 1.05 0.037 0.039 0.041 e 0.60 0.65 0.70 0.024 0.026 0.
PAGE 9
ESDAVLC8-1BM2, ESDAVLC8-1BT2 Package information Figure 23. SOD882T tape and reel specifications 2.0 ± 0.05 Ø 1.50 ± 0.10 4.0 ± 0.1 1.75 ± 0.1 Bar indicates Pin 1 3.5 ±- 0.05 1.15 ± 0.05 8.0 ±0.1 0.20 ± 0.05 X X X 0.70 ± 0.05 X X All dimensions in mm X X 0.47 ± 0.05 2.0 ± 0.
PAGE 10
Recommendation on PCB assembly ESDAVLC8-1BM2, ESDAVLC8-1BT2 4 Recommendation on PCB assembly 4.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 24. Stencil opening dimensions L T b) W General design rule Stencil thickness (T) = 75 ~ 125 µm W Aspect Ratio = ----- ≥ 1.5 T L×W Aspect Area = ---------------------------- ≥ 0.66 2T ( L + W ) 2.
PAGE 11
ESDAVLC8-1BM2, ESDAVLC8-1BT2 4.2 4.3 4.4 Recommendation on PCB assembly Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Solder paste with fine particles: powder particle size is 20-45 µm. Placement 1. Manual positioning is not recommended. 2.
PAGE 12
Recommendation on PCB assembly 4.5 ESDAVLC8-1BM2, ESDAVLC8-1BT2 Reflow profile Figure 26. ST ECOPACK® recommended soldering reflow profile for PCB mounting 240-245 °C Temperature (°C) 250 -2 °C/s to -3 °C/s -6 °C/s max 2 - 3 °C/s 60 sec (90 max) 200 150 100 0.9 °C/s 50 Time (s) 0 Note: 12/14 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement.
PAGE 13
ESDAVLC8-1BM2, ESDAVLC8-1BT2 5 Ordering information Ordering information Table 5. Ordering information Order code Marking(1) Package Weight Base qty Delivery mode ESDAVLC8-1BM2 I SOD882 0.92 mg 12000 Tape and reel ESDAVLC8-1BT2 J SOD882T 0.76 mg 12000 Tape and reel 1. The marking can be rotated by multiples of 90° to differentiate assembly location 6 Revision history Table 6. Document revision history Date Revision Changes 22-Jan-2010 1 Initial release.
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ESDAVLC8-1BM2, ESDAVLC8-1BT2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.