Datasheet

ESDAULC6-3BP6, ESDAULC6-3BF2 Package information
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Figure 25. Flip-Chip dimensions
Figure 28. Flip-Chip tape and reel specifications
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 26. Flip-Chip footprint Figure 27. Flip-Chip marking
1.1 mm ± 50 µm
1.6 mm ± 50µm
1.0 mm ± 50 µm
315 µm ± 50
500 µm ± 50
650 µm ± 65
Copper pad Diameter:
220 µm recommended
Solder stencil opening:
330 µmrecommended
Solder mask opening recommendation:
300 µmrecommended
x
y
x
w
z
w
E
Dot, ST logo
xx = marking
yww = datecode
(y = year
ww = week)
z = manufacturing location
Dot identifying Pin A1 location
User direction of unreeling
All dimensions in mm
4 +/- 0.1
8 +/- 0.3
4 +/- 0.1
1.75 +/- 0.1 3.5 +/- 0.1
Ø 1.5 +/- 0.1
0.71 +/- 0.05
xxz
yww
ST
E
xxz
yww
ST
E
xxz
yww
ST
E