Datasheet

ManualsBrandsSTMICROELECTRONICS ManualsDiodesTVS Diode

This is information on a product in full production.

October 2012 Doc ID 023846 Rev 1 1/12

ESDALCL5-1BM2

Single-line low capacitance and low leakage current

ESD protection

Datasheet − production data

Features

■ Single-line low capacitance Transil diode

■ Bidirectional ESD protection

■ Breakdown voltage V

= 5.0 V min.

■ Low diode capacitance (26 pF typ at 0 V)

■ Low leakage current:

– 10 nA at 3 V

– 1 nA at 1 V

■ Very small PCB area: 0.6 mm²

■ ECOPACK

2 compliant components

Complies with the following standards:

■ IEC 61000-4-2 level 4 and higher

– 30 kV (air discharge)

– 30 kV (contact discharge)

■ MIL STD 883G - Method 3015-7: class 3

– Human body model

Applications

Where transient overvoltage protection in ESD

sensitive equipment is required, such as:

■ Portable multimedia players and accessories

■ Portable healthcare equipment

■ Notebooks

■ Communication systems

■ Cellular phone handsets and accessories

Figure 1. Functional diagram

Description

The ESDALCL5-1BM2 is a bidirectional single-

line TVS diode designed to protect data lines or

other I/O ports against ESD transients.

This device is ideal for applications where

reduced line capacitance and board space saving

are required. Its low leakage current makes it

suitable for portable equipment.

SOD882

ESDALC5-1BM2

I/O1

I/O2

www.st.com

Summary of content (12 pages)

PAGE 1
ESDALCL5-1BM2 Single-line low capacitance and low leakage current ESD protection Datasheet − production data Features ■ Single-line low capacitance Transil diode ■ Bidirectional ESD protection ■ Breakdown voltage VBR = 5.0 V min. ■ Low diode capacitance (26 pF typ at 0 V) ■ Low leakage current: – 10 nA at 3 V – 1 nA at 1 V ■ Very small PCB area: 0.6 mm² ■ ECOPACK®2 compliant components SOD882 ESDALC5-1BM2 Complies with the following standards: ■ ■ Figure 1.
PAGE 2
Characteristics 1 ESDALCL5-1BM2 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol VPP PPP(1) Parameter Peak pulse voltage Value Unit ±30 kV 150 W 9 A IEC 61000-4-2 contact discharge IEC 61000-4-2 air discharge Peak pulse power dissipation (8/20 µs) Tj initial = Tamb IPP Peak pulse current (8/20 µs) Tj Junction temperature -55 to +150 °C Storage temperature range -65 to +150 °C 260 °C Tstg TL Maximum lead temperature for soldering during 10 s 1.
PAGE 3
ESDALCL5-1BM2 Figure 3. 1.1 Characteristics Relative variation of peak pulse power versus initial junction temperature Figure 4. PPP[Tjinitial]/PPP[Tjinitial = 25°C] Leakage current versus junction temperature (typical values, VR = 1 V) IR(pA) 1.0 0.9 0.8 1000 0.7 0.6 100 0.5 0.4 10 0.3 0.2 Tj(°C) 0.1 0.0 Tj(°C) 0 25 Figure 5. 50 75 100 125 1 0 20 40 60 80 100 120 140 150 Leakage current versus reverse applied voltage (typical values) Figure 6.
PAGE 4
Characteristics Figure 9. ESDALCL5-1BM2 Clamping voltage versus peak pulse current (typical values, exponential waveform, reverse) Figure 10. Junction capacitance versus reverse applied voltage (typical values, direct) IPP(A) 100.0 50 C(pF) 40 10.0 30 20 1.0 10 VCL(V) 0.1 6 8 10 12 14 16 Figure 11. Junction capacitance versus reverse applied voltage (typical values, reverse) 50 VLINE(V) 0 0 1 2 3 4 Figure 12.
PAGE 5
ESDALCL5-1BM2 2 Ordering information scheme Ordering information scheme Figure 15.
PAGE 6
Package information 3 ESDALCL5-1BM2 Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 16. SOD882 dimension definitions L1 L2 b1 b2 PIN # 1 ID e A A1 E D Table 3.
PAGE 7
ESDALCL5-1BM2 Package information Figure 17. SOD882 footprint in mm (inches) 0.55 (0.022) Figure 18. SOD882 marking 0.55 (0.022) 0.50 0.020 S Pin1 Pin 2 0.40 (0.016) Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Figure 19. SOD882 tape and reel specifications Cathode bar 2.0 Ø 1.50 4.0 1.15 3.5 1.75 0.
PAGE 8
Recommendations on PCB assembly ESDALCL5-1BM2 4 Recommendations on PCB assembly 4.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 20. Stencil opening dimensions L T b) W General design rule Stencil thickness (T) = 75 ~ 125 µm W Aspect Ratio = ----- ≥ 1.5 T L×W Aspect Area = ---------------------------- ≥ 0.66 2T ( L + W ) 2.
PAGE 9
ESDALCL5-1BM2 4.2 4.3 4.4 Recommendations on PCB assembly Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Solder paste with fine particles: powder particle size is 20-45 µm. Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering.
PAGE 10
Recommendations on PCB assembly 4.5 ESDALCL5-1BM2 Reflow profile Figure 22. ST ECOPACK® recommended soldering reflow profile for PCB mounting 240-245 °C Temperature (°C) 250 -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: 10/12 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement.
PAGE 11
ESDALCL5-1BM2 5 Ordering information Ordering information Table 4. Ordering information Order code Marking(1) Package Weight Base qty Delivery mode ESDALCL5-1BM2 S SOD882 0.92 mg 12,000 Tape and reel 1. The marking can be rotated by multiples of 90° to differentiate assembly location 6 Revision history Table 5. Document revision history Date Revision 31-Oct-2012 1 Changes Initial release.
PAGE 12
ESDALCL5-1BM2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.