Datasheet

Recommendation on PCB assembly ESDALC6V1-1M2
8/11 Doc ID 12385 Rev 7
4 Recommendation on PCB assembly
4.1 Stencil opening design
1. General recommendation on stencil opening design
a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 17. Stencil opening dimensions
b) General design rule
Stencil thickness (T) = 75 ~ 125 µm
2. Reference design
a) Stencil opening thickness: 100 µm
b) Stencil opening for leads: Opening to footprint ratio - between 60% and 65%.
Figure 18. Recommended stencil windows position
4.2 Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed.
4. Solder paste with fine particles: powder particle size is 20-45 µm.
L
T
W
Aspect Ratio
W
T
-----
1.5≥=
Aspect Area
LW×
2T L W+()
----------------------------
0.66≥=
Lead footprint on PCB
Stencil window
position
Lead footprint on PCB
Package footprint
0.45 mm
0.39 mm
0.05 mm 0.05 mm
Stencil window
position
0.055 mm