Datasheet

DocID16936 Rev 5 9/13
ESDALC5-1BM2, ESDALC5-1BT2 Recommendation on PCB assembly
3 Recommendation on PCB assembly
3.1 Stencil opening design
1. General recommendation on stencil opening design
a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 23. Stencil opening dimensions
b) General design rule
Stencil thickness (T) = 75 ~ 125 µm
2. Reference design
a) Stencil opening thickness: 100 µm
b) Stencil opening for central exposed pad: Opening to footprint ratio is 50%.
c) Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 24. Recommended stencil window position in mm (inches)
L
T
W
Aspect Ratio
W
T
-----
1,5≥=
Aspect Area
LW×
2T L W+()
----------------------------
0,66≥=
Lead footprint on PCB
Stencil window opening
0.55
(0.022)
0.50
(0.020)
0.40
(0.016)
0.522
(0.021)
0.474
(0.019)
0.014
(0.00055)
0.014
(0.00055)
0.013
(0.00051)
0.013
(0.00051)