Datasheet

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This is information on a product in full production.

April 2014 DocID16936 Rev 5 1/13

ESDALC5-1BM2, ESDALC5-1BT2

Single-line low capacitance Transil™,

transient surge voltage suppressor (TVS) for ESD protection

Datasheet − production data

Features

• Single-line low capacitance Transil diode

• Bidirectional ESD protection

• Breakdown voltage V

= 5.8 V min.

• Low diode capacitance (26 pF typ at 0 V)

• Low leakage current < 60 nA at 5 V

• Very small PCB area: 0.6 mm²

Benefits

• High ESD protection level

• High integration

• Suitable for high density boards

• Lead-free packages

• ECOPACK

2 compliant components

Complies with the following standards:

• IEC 61000-4-2 (exceeds level 4)

– 30 kV (air discharge)

– 30 kV (contact discharge)

• MIL STD 883G - Method 3015-7: class 3

– Human body model

Applications

Where transient overvoltage protection in ESD

sensitive equipment is required, such as:

• Computers

• Printers

• Communication systems

• Cellular phone handsets and accessories

• Video equipment

Description

The ESDALC5-1BM2 and ESDALC5-1BT2 are

bidirectional single-line TVS diodes designed to

protect data lines or other I/O ports against ESD

transients.

These devices are ideal for applications where

both reduced line capacitance and board space

saving are required.

Figure 1. Functional diagram

TM: Transil is a trademark of STMicroelectronics

SOD882

ESDALC5-1BM2

SOD882T

ESDALC5-1BT2

I/O1

I/O2

www.st.com

Summary of content (13 pages)

PAGE 1
ESDALC5-1BM2, ESDALC5-1BT2 Single-line low capacitance Transil™, transient surge voltage suppressor (TVS) for ESD protection Datasheet − production data Applications Where transient overvoltage protection in ESD sensitive equipment is required, such as: • Computers • Printers • Communication systems • Cellular phone handsets and accessories SOD882 ESDALC5-1BM2 • Video equipment SOD882T ESDALC5-1BT2 Description Features • Single-line low capacitance Transil diode • Bidirectional ESD protection • Breakdow
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Characteristics 1 ESDALC5-1BM2, ESDALC5-1BT2 Characteristics Table 1.
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ESDALC5-1BM2, ESDALC5-1BT2 Characteristics Figure 3. Peak pulse power dissipation versus initial junction temperature (maximum values) PPP (W) 250 Figure 4. Leakage current versus junction temperature (typical values) 1000 225 IR (nA) V R = V RM = 5 V fromI/O1 to I/O2 8/20µs 200 100 175 10 150 125 1 100 75 0,1 50 25 Tj(°C) 0 0 25 50 75 100 125 150 175 Figure 5.
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Characteristics ESDALC5-1BM2, ESDALC5-1BT2 Figure 9. Junction capacitance versus reverse Figure 10. Junction capacitance versus reverse applied voltage (typical values from I/O1 to I/O2) applied voltage (typical values from I/O2 to I/O1) C(pF) C(pF) 35 35 T j = 25-C F = 1MHz Vosc = 30mV from I/O1 to I/O2 30 25 25 20 20 15 15 10 10 5 0 T j = 25-C F = 1MHz Vosc = 30mV from I/O2 to I/O1 30 5 VR(V) 0 1 2 3 4 5 Figure 11.
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ESDALC5-1BM2, ESDALC5-1BT2 2 Package information Package information • Epoxy meets UL94, V0 • Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 15. SOD882 dimension definitions L1 L2 b1 b2 PIN # 1 ID e A A1 E D Table 3.
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Package information ESDALC5-1BM2, ESDALC5-1BT2 Figure 16. SOD882 footprint in mm (inches) 0.55 (0.022) Figure 17. SOD882 marking 0.50 (0.020) 0.55 (0.022) G I/O1 I/O2 0.40 (0.016) Note: Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only I/O1 mark is to be used for this purpose. Figure 18. SOD882 tape and reel specifications 2.0 ± 0.05 Ø 1.50 ± 0.10 4.
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ESDALC5-1BM2, ESDALC5-1BT2 Package information Figure 19. SOD882T dimension definitions L1 L2 b1 b2 PIN # 1 ID e A1 A E D Table 4. SOD882T dimension values Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 0.30 0.40 0.012 0.016 A1 0.00 0.05 0.000 0.002 b1 0.45 0.50 0.55 0.018 0.020 0.022 b2 0.45 0.50 0.55 0.018 0.020 0.022 D 0.55 0.60 0.65 0.022 0.024 0.026 E 0.95 1.00 1.05 0.037 0.039 0.041 e 0.60 0.65 0.70 0.024 0.026 0.
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Package information Note: ESDALC5-1BM2, ESDALC5-1BT2 Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only I/O1 mark is to be used for this purpose. Figure 22. SOD882T tape and reel specifications 2.0 ± 0.05 Ø 1.50 ± 0.10 4.0 ± 0.1 1.75 ± 0.1 Bar indicates Pin 1 3.5 ±- 0.05 1.15 ± 0.05 8.0 ±0.1 0.20 ± 0.05 2.0 ± 0.
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ESDALC5-1BM2, ESDALC5-1BT2 Recommendation on PCB assembly 3 Recommendation on PCB assembly 3.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 23.
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Recommendation on PCB assembly 3.2 3.3 3.4 10/13 ESDALC5-1BM2, ESDALC5-1BT2 Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Solder paste with fine particles: powder particle size is 20-45 µm. Placement 1. Manual positioning is not recommended. 2.
PAGE 11
ESDALC5-1BM2, ESDALC5-1BT2 3.5 Recommendation on PCB assembly Reflow profile Figure 25. ST ECOPACK® recommended soldering reflow profile for PCB mounting 240-245 °C Temperature (°C) 250 -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement.
PAGE 12
Ordering information 4 ESDALC5-1BM2, ESDALC5-1BT2 Ordering information Figure 26. Ordering information scheme ESDA LC 5 - 1 B x2 ESD array Low capacitance Breakdown voltage 5 = 5 Volts min Number of lines Directional B = Bi-directional Package M2 = SOD882 T2 = Thin SOD882 Table 5. Ordering information Order code Marking(1) Package Weight Base qty Delivery mode ESDALC5-1BM2 G SOD882 0.93 mg 12000 Tape and reel ESDALC5-1BT2 H SOD882T 0.82 mg 12000 Tape and reel 1.
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ESDALC5-1BM2, ESDALC5-1BT2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.