Datasheet

Recommendation on PCB assembly ESDA-1K
8/10 Doc ID 17883 Rev 1
4.4 Reflow profile
Figure 13. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Note: Minimize air convection currents in the reflow oven to avoid component movement.
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Time (min)
Temperature (°C)
2°C/s recommended
6°C/s max
220°C
125 °C
260°C max
255°C
180°C
90 sec max
10-30 sec
90 to 150 sec
3°C/s max
0
01234567
Time (min)
Temperature (°C)
2°C/s recommended
6°C/s max
220°C
125 °C
260°C max
255°C
180°C
90 sec max
10-30 sec
90 to 150 sec
3°C/s max