Datasheet

ManualsBrandsSTMICROELECTRONICS ManualsLinear ICsLinear IC - Audio amplifier 2-channel (stereo) or 4-channel (Quad) Class AB Multiwatt 15

1/15

TDA7375V

September 2013

1FEATURES

■ HIGH OUTPUT POWER CAPABILITY:

– 2 x 40W max./4

– 2 x 35W/4 EIAJ

– 2 x 25W/4 @14.4V, 1KHz, 10%

– 4 x 7W/4 @14.4V,1KHz, 10%

– 4 x 12W/2 @14.4V, 1KHz, 10%

■ MINIMUM EXTERNAL COMPONENTS

COUNT:

– NO BOOTSTRAP CAPACITORS

– NO BOUCHEROT CELLS

– INTERNALLY FIXED GAIN (26dB BTL)

■ ST-BY FUNCTION (CMOS COMPATIBLE)

■ NO AUDIBLE POP DURING ST-BY

OPERATIONS

■ DIAGNOSTICS FACILITY FOR:

– CLIPPING

– OUT TO GND SHORT

–OUT TO V

SHORT

– SOFT SHORT AT TURN-ON

– THERMAL SHUTDOWN PROXIMITY

2 PROTECTIONS:

■ OUPUT AC/DC SHORT CIRCUIT

–TO GND

–TO V

– ACROSS THE LOAD

■ SOFT SHORT AT TURN-ON

■ OVERRATING CHIP TEMPERATURE WITH

■ SOFT THERMAL LIMITER

■ LOAD DUMP VOLTAGESURGE

■ VERY INDUCTIVE LOADS

■ FORTUITOUS OPEN GND

■ REVERSED BATTERY

■ ESD

2 x 35W dual/quad power amplifier for car radio

Figure 2. Block Diagram

Rev. 5

Figure 1. Package

Table 1. Order Codes

Part Number Package

TDA7375V MULTIWATT 15 (Vertical)

MULTIWATT15

Summary of content (15 pages)

PAGE 1
TDA7375V 2 x 35W dual/quad power amplifier for car radio 1 ■ ■ ■ FEATURES Figure 1. Package HIGH OUTPUT POWER CAPABILITY: – 2 x 40W max./4 – 2 x 35W/4 EIAJ – 2 x 35W/4 EIAJ – 2 x 25W/4 @14.4V, 1KHz, 10% – 4 x 7W/4 @14.4V,1KHz, 10% – 4 x 12W/2 @14.4V, 1KHz, 10% MINIMUM EXTERNAL COMPONENTS COUNT: – NO BOOTSTRAP CAPACITORS – NO BOUCHEROT CELLS – INTERNALLY FIXED GAIN (26dB BTL) ST-BY FUNCTION (CMOS COMPATIBLE) MULTIWATT15 Table 1.
PAGE 2
TDA7375V 3 DESCRIPTION The TDA7375V is a new technology class AB car radio amplifier able to work either in DUAL BRIDGE or QUAD SINGLE ENDED configuration. The exclusive fully complementary structure of the output stage and the internally fixed gain guarantees the highest possible power performances with extremely reduced component count. The on-board clip detector simplifies gain compression operation.
PAGE 3
TDA7375V Table 4. Electrical Characteristcs (Refer to the test circuit, VS = 14.4V; RL = 4; f = 1KHz; Tamb = 25°C, unless otherwise specified) Symbol Parameter VS Supply Voltage Range Id Total Quiescent Drain Current VOS Output Offset Voltage PO Output Power Test Condition RL =  40 W 32 35 W 0.02 0.03 EIN Input Noise Voltage % % f = 1KHz Single Ended 70 dB 60 dB 60 dB 55 f = 10KHz Bridge Voltage Gain Match 0.3 f = 10KHz Single Ended f = 1KHz Bridge GV mV 36 VS = 13.
PAGE 4
TDA7375V 4 STANDARD TEST AND APPLICATION CIRCUIT Figure 4. Quad Stereo 10K R1 ST-BY C7 10μF IN FL 4 13 7 3 1 C1 0.22μF IN FR 5 12 C4 0.22μF OUT FL C9 2200μF OUT FR C11 2200μF OUT RL C12 2200μF OUT RR 15 IN RR 11 C3 0.22μF Note: C9, C10, C11, C12 could be reduced if the 2W operation is not required. C10 2200μF 2 C2 0.22μF IN RL VS C5 1000μF C6 100nF 6 14 8 10 9 C8 47μF DIAGNOSTICS D94AU063A Figure 5. Double Bridge 10K R1 ST-BY C5 10μF IN L 7 4 C1 0.
PAGE 5
TDA7375V Figure 7. P.C. Board and Component Layout of the fig.4 Figure 8. P.C. Board and Component Layout of the fig.
PAGE 6
TDA7375V Figure 9. Quiescent Drain Current vs. Supply Voltage (Single Ended and Bridge). Figure 12. Output Power vs. Supply Voltage Figure 10. Quiescent Output Voltage vs. Supply Voltage (Single Ended and Bridge). Figure 13. OutputPower vs. Supply Voltage Figure 11. Output Power vs. Supply Voltage Figure 14. Distortion vs.
PAGE 7
TDA7375V Figure 15. Distortion vs. Output Power Figure 18. Supply Voltage Rejection vs. Frequency Figure 16. Distortion vs. Output Power Figure 19. Supply Voltage Rejection vs. Frequency Figure 17. Cross-talk vs. Frequency Figure 20. Stand-by Attenuation vs.
PAGE 8
TDA7375V Figure 21. Total Power Dissipation and Efficiency vs. Output Power 5 Figure 22. Total Power Dissipation and Efficiency vs. Output Power GENERAL STRUCTURE 5.1 High Application Flexibility The availability of 4 independent channels makes it possible to accomplish several kinds of applications ranging from 4 speakers stereo (F/R) to 2 speakers bridge solutions.
PAGE 9
TDA7375V driven by a voltage source whose current capability is higher than 5mA. In practical cases a series resistance has always to be inserted, having it the double purpose of limiting the current at pin 7 and to smooth down the stand-by ON/OFF transitions - in combination with a capacitor - for output pop prevention. In any case, a capacitor of at least 100nF from pin 7 to S-GND, with no resistance in between, is necessary to ensure correct turn-on. 5.
PAGE 10
TDA7375V vice itself and for the loudspeaker. This particular kind of protection acts in a way to avoid that the device is turned on (by ST-BY) when a resistive path (less than 16 ohms) is present between the output and GND. As the involved circuitry is normally disabled when a current higher than 5mA is flowing into the ST-BY pin, it is important, in order not to disable it, to have the external current source driving the ST-BY pin limited to 5mA.
PAGE 11
TDA7375V Figure 26. Output Fault Waveforms (see fig. 27) Figure 27. Fault Waveforms 5.8 HANDLING OF THE DIAGNOSTICS INFORMATION As various kinds of information is available at the same pin (clipping detection, output fault, thermal proximity), this signal must be handled properly in order to discriminate each event. This could be done by taking into account the different timing of the diagnostic output during each case.
PAGE 12
TDA7375V Figure 28. Waveforms Figure 29. Interface circuitry to differentiate the information schematic 5.9 PCB-LAYOUT GROUNDING (general rules) The device has 2 distinct ground leads, P-GND (POWER GROUND) and S-GND (SIGNAL GROUND) which are practically disconnected from each other at chip level. Proper operation requires that P-GND and S-GND leads be connected together on the PCB-layout by means of reasonably low-resistance tracks.
PAGE 13
TDA7375V 6 PACKAGE INFORMATION In order to meet environmental requirements, ST (also) offers these devices in ECOPACK® packages. ECOPACK® packages are lead-free. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 30.
PAGE 14
TDA7375V 7 REVISION HISTORY Table 5. Revision History 14/15 Date Revision Description of Changes July 2004 2 First Issue in EDOCS March 2005 3 Changed the Style-sheet in compliance to the new “Corporate Technical Pubblications Design Guide”. Deleted package Multiwatt15 Horizontal. 01-Jul-2008 4 Updated the root part number in the title of the cover page. Added Ecopack information in “PACKAGE INFORMATION” section. 20-Sep-2013 5 Updated Disclaimer.
PAGE 15
TDA7375V Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.