User Manual

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Document ID: PB-ZB-MOD-003-20DS
6 SOLDERING
6.1 SOLDER TEMPERATURE PROFILE
The following Fig. 6.1 illustrates the solder temperature profile for the module. This temperature profile is similar for other
RoHS compliant packages, but manufacturing lines should be programmed with this profile in order to guarantee proper solder
connection to the PCB. Please note: module can be soldered only once.
Reflow Profile
Fig. 6.1 Reflow profile
6.2 PROFILE PARAMETERS
The following table 6.1 contains the temperature profile parameters.
Important note: module should be processed according to recommended temperature profile only one time.
Table 6.1 Solder Reflow Parameters
Parameter
Value
Average Ramp Up Rate (from Tsoak
max
to Tpeak)
3°C per second max
Average Ramp Up Rate (from 25°C to Tsoak
min
)
2°C to 4°C per second max
Minimum Soak Temperature (Tsoak
m
j
n
)
150°C
Maximum Soak Temperature (Tsoak
max
)
200°C
TL
220°C
Time above TL
30 to 60 seconds
Minimum Peak Temperature Tpeak
min
230°C
Maximum Peak Temperature Tpeak
max
250°C
Ramp Down Rate
6°C per second max