User Manual

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Document ID: PB-ZB-MOD-003-20DS
TABLE OF CONTENT
1 FEATURE LIST....................................................................................................................................... 3
2 MODULE VARIANTS............................................................................................................................... 4
2.1 INTRODUCTION ............................................................................................................................ 4
2.2 DIZIC 802.15.4 RF MODULE: OUTPUT OPTIONS ...................................................................... 4
2.3 DIZIC 802.15.4 RF MODULE: POWER LEVEL OPTIONS ............................................................ 5
2.4 DIZIC 802.15.4 RF MODULE: STACK OPTIONS ........................................................................ 5
2.5 DIZIC 802.15.4 RF MODULE: EMI PROTECTION OPTIONS ...................................................... 5
3 COMPONENTS OVERVIEW .................................................................................................................... 6
3.1 STM32W108 SYSTEM-ON-CHIP ............................................................................................ 6
3.2 RF FRONT END WITH RF OUTPUT POWER LEVEL DETECTOR ................................................. 7
3.3 RF FRONT END ........................................................................................................................... 8
3.4 ZIGBEE STACKS .......................................................................................................................... 8
4 ELECTRICAL CHARACTERISTICS ........................................................................................................... 9
4.1 PARAMETER CONDITIONS ........................................................................................................... 9
4.1.1 Minimum and maximum values ............................................................................................ 9
4.1.2 Typical values .......................................................................................................................... 9
4.2 ABSOLUTE MAXIMUM RATINGS .................................................................................................... 9
4.3 OPERATING CONDITIONS .......................................................................................................... 10
4.3.1 General operating conditions .............................................................................................. 10
4.3.2 Electrostatic discharge (ESD) ............................................................................................. 10
4.4 DC CHARACTERISTICS ............................................................................................................. 11
4.5 RF CHARACTERISTIC ................................................................................................................ 13
4.5.1 Receiver ................................................................................................................................. 13
4.5.2 Transmitter ............................................................................................................................. 13
5 MECHANICAL CHARACTERISTICS ........................................................................................................ 14
5.1 MODULE PAD DIAGRAM ............................................................................................................ 14
5.2 MODULE PAD DESCRIPTION ..................................................................................................... 15
5.3 PACKAGE MECHANICAL DIMENSIONS ....................................................................................... 20
6 SOLDERING ........................................................................................................................................ 21
6.1 SOLDER TEMPERATURE PROFILE ........................................................................................... 21
6.2 PROFILE PARAMETERS ............................................................................................................ 21
6.3 RECOMMENDED FOOTPRINT .................................................................................................... 22
7 ORDERING INFORMATION ................................................................................................................... 23
8 LIST OF ACRONYMS ............................................................................................................................ 24
9 REFERENCES & REVISION HISTORY ................................................................................................... 25